Embedded Button Design for Electronic Devices Without Through Holes
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Solution Overview
Problem
Traditional physical buttons in electronic devices, such as mobile phones, allow water, vapor, and dust to enter through gaps surrounding the button, potentially damaging the device due to repeated up and down operations.
Innovation Solution
An embedded button design without a surrounding gap, where the button area bends for operation, eliminating the need for a through hole and thus preventing contamination by using a pressure switch with piezo-sensitive material and flexible substrates to generate activating signals upon pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a traditional physical button with a through hole is used, then the button can be operated by moving up and down, but water, vapor, and dust can enter through the gap surrounding the button
Solution Approach 1:
The patent removes the through hole and surrounding gap from the device structure. The button is embedded within the housing without penetrating through, eliminating the contamination pathway while preserving the pressing operation capability through the embedded structure
Solution Approach 2:
The patent replaces the traditional mechanical button structure with an embedded button that utilizes a pressure-sensitive layer and switching element. The pressing action is detected through pressure sensitivity rather than mechanical movement through a hole, eliminating the need for a through hole
2Ease of operation
If a physical button protrudes above the frame, then the button can be easily pressed, but the gap surrounding the button allows contamination particles to enter
Solution Approach 1:
The patent introduces an embedded button structure that acts as an intermediary between the user's pressing action and the internal switching element. The button is surrounded by a sealing structure that mediates between the external pressing force and the internal components, preventing contamination while transmitting the pressing signal
Solution Approach 2:
The patent employs a pressure-sensitive layer that can be flexible or elastic in nature, allowing the button to respond to pressing forces while maintaining a sealed structure. The flexible membrane or thin film structure enables pressure detection without requiring a through hole
3Ease of operation
If a through hole is made through the outer frame for the button, then the button can pass through for operation, but repeated operation introduces contamination particles into the device
Solution Approach 1:
The patent extracts and eliminates the through hole from the outer frame structure. The button is embedded within the housing without creating a passage through the frame, removing the source of contamination particle generation while maintaining operational functionality through the embedded pressure-sensitive structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents water, vapor, and dust from entering the device, enhancing durability and reliability by eliminating contamination pathways while maintaining a functional button mechanism.
Implementation Method 1
A pressure switch 253 is configured below the inner bump. The pressure switch 253 has a piezo-sensitive material 265
Data Source
AI summary
An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.