Embedded Cable Routing Assembly for Low-Loss Chip Interconnects
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Solution Overview
Problem
High-speed data transmission systems face significant signal loss and design challenges due to the use of FR4 material in circuit boards, which becomes lossy at frequencies above 10 GHz, requiring additional active components and complex routing that increases costs and complicates design.
Innovation Solution
A routing assembly with embedded cables and low-profile wire-to-board connectors that directly connect a chip package to external connectors, eliminating the need for high-speed routing traces on the motherboard and using a dielectric tray to support cables in an L-shaped configuration, thereby reducing signal loss and simplifying the design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If FR4 material is used for circuit boards, then manufacturing cost is reduced, but signal loss increases at high frequencies
Solution Approach 1:
The patent extracts the high-speed signal transmission function from the FR4 circuit board by using embedded cables with dedicated transmission lines. This separates the low-cost FR4 substrate from the high-frequency signal path, allowing FR4 to be used for structural support and low-speed signals while dedicated cable assemblies handle the high-speed data transmission with minimal signal loss.
2Reliability
If active components such as amplifiers and equalizers are added to compensate for signal loss, then signal transmission is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent converts the inherent low-loss property of cable assemblies into a design advantage by routing high-speed signals through embedded cables rather than through FR4 traces. This approach eliminates the need for signal compensation components by designing the transmission path to inherently maintain signal integrity, thereby reducing device complexity while improving reliability.
3Ease of operation
If transmission line traces are routed through FR4 circuit board, then connection between chip and external connectors is established, but signal loss increases with trace length
Solution Approach 1:
The patent introduces embedded cables as an intermediary medium between the chip package and external connectors. These cables serve as dedicated transmission lines that mediate the signal path, providing controlled impedance and minimal signal loss compared to traditional FR4 traces. The cables are integrated into the circuit board structure, maintaining ease of routing while dramatically reducing signal loss.
4Reliability
If multiple layers are added to control impedance in high-speed trace routing, then signal integrity is improved, but manufacturing cost and design time increase
Solution Approach 1:
The patent extracts the impedance control function from the multi-layer FR4 structure by using dedicated cable assemblies with inherent controlled impedance. This eliminates the need for complex multi-layer board construction specifically for impedance management, as the cable assemblies provide consistent impedance characteristics by design, thereby reducing manufacturing cost while maintaining signal integrity.
Data Source
AI summary
A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.