Embedded Component Circuit Board with Integrated Capacitance
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Solution Overview
Problem
Circuit board structures with ceramic substrates have low bending strength, are limited to small sizes, and lack efficient methods for forming capacitance components directly.
Innovation Solution
A circuit board structure with a carrier board comprising adhesive layers and metal oxide layers, embedded semiconductor chips, and a high dielectric material layer forming a capacitance component, enhancing structural strength and simplifying the structure by integrating capacitance components directly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic substrate is used as a carrier board, then the circuit board structure can be formed with embedded components, but the bending strength is low
Solution Approach 1:
The patent changes the material parameters of the carrier board from traditional ceramic to a composite structure consisting of a rigid board combined with reinforcement plates. This parameter change maintains the embedding capability while significantly improving bending strength through the reinforcement plates made of materials with higher mechanical strength properties.
Solution Approach 2:
The invention creates a composite structure by combining the rigid board (carrier board) with reinforcement plates to form a hybrid structure. This composite approach leverages the embedding advantages of the rigid board while adding the mechanical strength of the reinforcement plates, thereby resolving the contradiction between manufacturing ease and bending strength.
2Area of stationary object
If a ceramic substrate is used, then components can be embedded, but the substrate size is limited to small dimensions
Solution Approach 1:
The patent divides the carrier board into a base rigid board and separate reinforcement plates that can be selectively added. This segmentation allows the substrate to be scaled to larger dimensions while maintaining structural integrity through the distributed reinforcement plates, overcoming the size limitation of traditional ceramic substrates.
Solution Approach 2:
By creating a composite structure with reinforcement plates, the invention enables the substrate to achieve larger areas without proportionally increasing fragility. The reinforcement plates are strategically placed to provide strength where needed, allowing the overall substrate size to expand beyond traditional ceramic limitations.
3Device complexity
If passive components are embedded in ceramic substrates, then component integration is achieved, but the fabrication process becomes complex
Solution Approach 1:
The patent forms the capacitance component directly within the rigid board during the board fabrication process itself, rather than embedding separate passive components afterward. This preliminary action integrates the capacitance function into the board structure, simplifying the overall fabrication process and reducing the number of manufacturing steps required.
Solution Approach 2:
The invention merges the function of the rigid board with the function of the capacitance component by forming the capacitance component directly within the board structure. This consolidation eliminates the need for separate passive component embedding steps, thereby reducing device complexity and streamlining the fabrication process.
4Productivity
If separate passive components are embedded, then capacitance functionality is achieved, but the fabrication efficiency is reduced
Solution Approach 1:
The capacitance component is formed during the board fabrication process itself, performing the capacitance creation action preliminarily rather than as a separate post-processing step. This preliminary formation of the capacitance component significantly improves fabrication efficiency by eliminating additional embedding and connection steps.
Solution Approach 2:
By combining the board fabrication process with the capacitance component formation process, the invention achieves both structural creation and functional integration in a single workflow. This merging of processes improves productivity by reducing the total number of fabrication steps and enhancing structure integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the bending strength of the circuit board and allows for the direct integration of capacitance components, overcoming limitations of ceramic substrates.
Implementation Method 1
the first and second metal oxide layers being formed via an oxidation process on the first and second metal layers
Implementation Method 2
an adhesive material filling a gap between the carrier board and the semiconductor chip so as to secure the semiconductor chip in position
Implementation Method 3
the second metal layer, high dielectric material layer, and electrode board are together formed into a capacitance component
Data Source
AI summary
A circuit board structure with embedded electronic components includes: a carrier board having an adhesive layer with two surfaces formed with first and second metal oxide layers covered by first and second metal layers and having at least one through hole; at least one semiconductor chip received in the through hole of the carrier board; an adhesive material filling a gap between the through hole and the semiconductor chip so as to secure the semiconductor chip in position to the through hole; a high dielectric material layer formed outwardly on the second metal layer; and at least one electrode board formed outwardly on the high dielectric material layer such that a capacitance component is formed with the second metal layer, high dielectric material layer, and electrode board. Accordingly, the capacitance component is integrated into the circuit board structure.