Embedded Multilayer Ceramic Capacitor Electrode Design for ESL Reduction
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Solution Overview
Problem
The challenge in manufacturing printed circuit boards (PCBs) with embedded multilayer ceramic electronic components is the difficulty in forming via holes using laser beam machining due to copper plating solutions permeating and affecting the current path length, leading to increased equivalent series inductance (ESL) and occupied area, especially as the number of components increases with rising application processor speeds.
Innovation Solution
A multilayer ceramic electronic component design with copper terminal electrodes and a specific configuration of internal and external electrodes, where the width of external electrodes is between 150 μm and 350 μm, and the ratio of width to length is greater than or equal to 0.6, along with a copper plated layer, facilitates shorter current paths and reduced ESL by avoiding glass absorption during laser processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper plated layer is separately formed on external electrodes of an embedded multilayer ceramic electronic component, then the external electrodes can be electrically connected to circuit within board through via, but the plating solution may permeate into the external electrodes, making it difficult to shorten the current path and increase ESL
Solution Approach 1:
The patent changes the material parameter of the external electrodes from traditional nickel/tin plated layers to copper-based materials. This material substitution allows the external electrodes to serve dual functions: providing reliable electrical connection through via holes while simultaneously enabling shorter current paths. The copper material's properties facilitate both penetration resistance during plating and reduced inductance through optimized electrode geometry.
Solution Approach 2:
The external electrodes in this patent perform multiple functions simultaneously: (1) providing electrical connection to internal electrodes, (2) serving as contact pads for via holes, and (3) functioning as inductance-reducing elements through their extended shape. This multi-functionality eliminates the need for separate nickel/tin plated layers while achieving both reliable connection and shortened current paths.
2Ease of manufacture
If laser beam machining is used to form via holes in upper stacked plate and lower stacked plate, then board wirings and external electrodes can be connected, but manufacturing costs of PCB considerably increase
Solution Approach 1:
The patent changes the material composition parameter of external electrodes to copper-based materials, which have different laser absorption characteristics compared to traditional nickel/tin plated layers. This material change enables the use of alternative via formation methods that are more cost-effective, as copper's optical and thermal properties allow for more efficient laser processing or alternative machining approaches.
3Productivity
If the number of embedded multilayer ceramic electronic components increases to meet rising application processor speeds, then performance can be improved, but occupied area on PCB continuously increases
Solution Approach 1:
The patent extends the external electrodes in the width direction (lateral dimension) rather than only in the thickness direction. This dimensional change allows the electrodes to provide both electrical connection and inductance reduction functions within a smaller footprint area, enabling higher component density and reducing the occupied area on the PCB while maintaining or improving processing speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient via processing, reduces ESL, and decreases the occupied area on the PCB, enhancing the reliability and performance of embedded multilayer ceramic capacitors by maintaining the integrity of the current path and preventing delamination.
Implementation Method 1
since external electrodes include glass, a component included in the glass may absorb a laser in the event of laser beam machining to form a via within a board
Data Source
AI summary
A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L≧0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 μm≦BW≦350 μm.