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Solution Overview
Problem
Existing semiconductor devices face increased wiring loss and difficulty in shortening the connection distance between voltage regulators and loads, hindering downsizing and stability due to capacitive coupling noise.
Innovation Solution
A module with a capacitor layer and through-hole conductor configuration that electrically connects the voltage regulator and load, reducing wiring length and capacitive coupling, thereby minimizing loss and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the connection distance between voltage regulator and load is increased, then device complexity is reduced, but wiring loss increases
Solution Approach 1:
The patent transitions from planar surface mounting to three-dimensional vertical stacking by forming capacitor layers and conductor layers at different heights within the package board. This spatial reconfiguration allows electrical connections to be made in the thickness direction through through-hole conductors, effectively reducing wiring length and energy loss while maintaining device functionality.
Solution Approach 2:
The patent embeds capacitor elements and conductor structures within the package board's internal layers, creating a nested configuration where functional components are integrated into the board's thickness rather than arranged on its surface. This nesting approach minimizes external wiring requirements and reduces energy loss.
2Loss of energy
If the connection distance between voltage regulator and load is shortened, then wiring loss is reduced, but device complexity increases
Solution Approach 1:
The patent utilizes the thickness direction of the package board to create vertical electrical pathways through through-hole conductors. This dimensional transition from two-dimensional surface routing to three-dimensional internal routing shortens connection distances while integrating complexity into the board's internal structure rather than increasing external component count.
Solution Approach 2:
The patent combines multiple functions into integrated structures: capacitor layers serve both as electrical components and as part of the package board's internal architecture, while through-hole conductors simultaneously provide electrical connections and structural integration. This merging reduces the need for separate wiring elements.
3Ease of manufacture
If capacitor array is implemented using conventional method, then manufacturing is simplified, but connection distance between voltage regulator and load cannot be shortened
Solution Approach 1:
The patent forms capacitor layers and conductor layers in the thickness direction of the package board using standard semiconductor fabrication techniques adapted for thick-film applications. This vertical layering approach maintains manufacturing compatibility while enabling shorter horizontal connection distances between components.
Solution Approach 2:
The patent divides the capacitor structure into multiple layers (first capacitor layer, second capacitor layer) with intermediate conductor layers, allowing each layer to be formed using conventional manufacturing processes. This segmentation enables the implementation of three-dimensional capacitor arrays without requiring new manufacturing methodologies.
4Volume of moving object
If connection distance between voltage regulator and load is increased, then device downsizing is facilitated, but capacitive coupling noise increases
Solution Approach 1:
The patent routes power and ground connections vertically through through-hole conductors in the thickness direction, creating compact electrical pathways that minimize loop areas. This vertical routing reduces capacitive coupling between signal lines and power/ground lines, thereby reducing noise while enabling compact device packaging.
Solution Approach 2:
The patent introduces ground lines positioned between power lines and signal lines as intermediary shielding structures. These ground lines act as electromagnetic shields that reduce capacitive coupling and noise interference, allowing for compact layouts without sacrificing signal integrity.
Data Source
AI summary
A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.