Embedded Capacitor Substrate Through-Hole Layout for Easier Plating
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Solution Overview
Problem
Existing methods struggle to form capacitor through-hole conductors connected to anode plates using general techniques, due to the difficulty in metallizing surfaces with exposed different metals like aluminum and copper.
Innovation Solution
A capacitor embedded substrate design that includes a capacitor portion with an anode plate having a porous portion, a dielectric layer, and a cathode layer, along with specific through-holes and conductors that allow for the formation of capacitor through anode conductors using general techniques like plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole conductors are formed by plating on surfaces with exposed different metals (aluminum and copper), then electrical connection is achieved, but the metallization process becomes extremely difficult and complex
Solution Approach 1:
The patent divides the through-hole into two distinct regions: a first region containing only the anode plate and a second region containing both the anode plate and conductive portion. This segmentation allows different plating processes to be applied to different regions, avoiding the complexity of plating on mixed metal surfaces while ensuring reliable electrical connections in both regions
Solution Approach 2:
The patent applies different plating conditions to different regions of the through-hole. The first region receives plating treatment optimized for aluminum surfaces, while the second region receives plating treatment optimized for copper surfaces. This local quality approach ensures optimal metallization in each region without requiring a single complex process that handles both metals simultaneously
2Ease of manufacture
If general plating techniques are used to form capacitor through-hole conductors connected to anode plates, then manufacturing simplicity is maintained, but the process fails due to difficulty in metallizing surfaces with exposed different metals
Solution Approach 1:
The patent segments the through-hole formation process into two stages: first forming a through-hole that extends only to the anode plate, then forming a separate second through-hole that extends further to expose the conductive portion. This segmentation enables the use of simple, standard plating techniques in each stage rather than requiring a complex single-step process
Solution Approach 2:
The patent performs preliminary actions by first forming the capacitor portion with its anode plate and conductive portion, then forming through-holes that selectively expose these components. This preliminary structuring allows subsequent plating to be applied to predetermined surfaces, ensuring reliable conductor formation without needing to handle unpredictable mixed metal exposures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of capacitor through anode conductors connected to the anode plate using general techniques, improving manufacturing efficiency and reducing the complexity of metallization processes.
Implementation Method 1
inner surfaces of the through-holes 263 and 265 are then metallized by electroless Cu plating or the like, whereby the through-hole conductors 262 and 264 are formed
Data Source
AI summary
A capacitor embedded substrate that includes: a wiring substrate; and a capacitor element embedded in the wiring substrate. The capacitor element includes a capacitor portion and a sealing layer covering the capacitor portion. At least one first capacitor through-hole and at least one second capacitor through-hole extend through the capacitor element. A capacitor through anode conductor is inside the first capacitor through-hole and connected to an anode plate of the capacitor portion. A first substrate through-hole is in the first capacitor through-hole and a second substrate through-hole is in the second capacitor through-hole, the first substrate through-hole and the second substrate through-hole extends through the wiring substrate and the capacitor element. A substrate through anode conductor is in the first substrate through-hole and electrically connected to the anode plate. A substrate through cathode conductor is in the second substrate through-hole and electrically connected to the cathode layer.