Embedded Capacitor Substrate Structure with Roughened Surface Bonding
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Solution Overview
Problem
Conventional semiconductor packaging methods face challenges with increased noise due to higher connection leads, require larger substrate sizes, and are complex to fabricate, as capacitor components are surface-mounted with weak bonding and limited flexibility for capacitance value changes.
Innovation Solution
A substrate structure with embedded capacitor components, where the capacitor surfaces are pretreated with a surface roughness process to enhance bonding strength, and dielectric layers secure them within holes in the substrate, allowing flexible capacitance adjustments and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If capacitor components are surface-mounted on the substrate, then the substrate structure can be fabricated, but the bonding strength between capacitor components and substrate is weak causing dislodgement under external vibration
Solution Approach 1:
The capacitor component is embedded within a cavity formed in the substrate, nesting the capacitor inside the substrate structure rather than mounting it on the surface. This embedding approach provides mechanical support from the substrate material surrounding the capacitor, significantly improving bonding strength and resistance to dislodgement under external vibration.
2Ease of operation
If capacitor components are placed on surface areas not occupied by circuitry, then capacitor components can be positioned, but the substrate surface area increases resulting in larger package size
Solution Approach 1:
The capacitor component is positioned in the vertical dimension by embedding it within a cavity in the substrate, rather than placing it on the horizontal surface. This dimensional transition from surface mounting to embedded positioning allows the capacitor to be integrated within the substrate thickness, reducing the required substrate surface area and enabling smaller package size.
3Ease of manufacture
If capacitor components are separately mounted onto the substrate structure, then capacitor components can be installed, but the complexity of the chip circuitry and fabricating process increases
Solution Approach 1:
The capacitor component embedding process is merged with the substrate fabrication process. The cavity is formed and the capacitor is embedded during the same manufacturing sequence as the substrate itself, rather than as a separate post-fabrication step. This integration reduces the number of discrete manufacturing operations and simplifies the overall fabricating process.
4Ease of manufacture
If the substrate structure is designed for a single electrical function, then the substrate can be fabricated, but it cannot be flexibly modified to adapt and incorporate other electrical components or semiconductor components
Solution Approach 1:
The substrate is designed with a universal cavity structure that can accommodate different types of electronic components (capacitors, resistors, semiconductors) with varying capacitance values and electrical functions. The standardized embedding approach allows the same substrate design to serve multiple electrical functions and be flexibly modified for different component types without requiring new substrate designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves bonding strength, reduces substrate size, and simplifies the fabrication process by embedding capacitor components, enabling flexible capacitance modifications and integration with other components, thus addressing miniaturization and high-performance requirements.
Implementation Method 1
the surface of the capacitor component is pretreated with a surface roughness process before or after the capacitor component is embedded in the hole
Data Source
AI summary
A capacitor components embedded substrate structure comprises a substrate, capacitor components, a first and second dielectric layers, and a circuit layer. The substrate includes a first surface, a second surface, and a hole penetrating the first and the second surfaces. The capacitor components whose surface is pretreated with a roughness process is received in the hole of the substrate, such that at least one surface of the capacitor components is disposed with a plurality of electrode pads. The first and the second dielectric layers are formed on the surface of substrate and the surface of the capacitor components respectively such that the capacitor components are secured in position in the hole of the substrate. The first and the second dielectric layers have a plurality of openings to expose the electrode pads of the capacitor components. The circuit layer is formed on the surface of the first and second dielectric layers, and a conductive structure is formed in the opening of the first and second dielectric layers for electrically connecting the circuit layer to the electrode pads of the capacitor components. The present invention further provides a method for fabricating a capacitor components embedded substrate structure. The capacitor components embedded substrate structure and the method for fabricating the same of the present invention reinforces the bonding strength between the capacitor components and the substrate, reduces substrate package sizes, and allows circuit layout design to be more flexible.