Embedded Deep Trench Capacitor Stack for Stable Package Power
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Solution Overview
Problem
High-power semiconductor dies require stable voltage and efficient power delivery, which is challenging due to the space and mechanical stability issues posed by traditional capacitor placement on circuit boards.
Innovation Solution
Embedding deep trench capacitors within the substrate core of a circuit board and using a spacer to stabilize the power components, allowing for efficient power delivery and mechanical support, while reducing the overall height and eliminating the need for additional filler material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are placed on the same package as the dies, then power delivery performance is improved, but device complexity and space usage increase
Solution Approach 1:
The patent merges the capacitor with the substrate core by embedding it within the substrate's internal cavity, forming an integrated power delivery system. This combination eliminates the need for separate capacitor components on the package surface, reducing overall device complexity while maintaining improved power delivery performance through proximity to the die.
Solution Approach 2:
The capacitor is nested within the substrate core's internal cavity, utilizing the substrate's three-dimensional structure. This nesting approach allows the capacitor to be housed inside the existing substrate volume rather than adding external components, thereby improving power delivery without increasing package footprint or complexity.
2Reliability
If deep trench capacitors are used, then voltage stability is improved, but manufacturing complexity increases
Solution Approach 1:
The deep trench capacitor is segmented into discrete etched regions within the substrate, with individual trenches forming capacitor structures at specific locations. This segmentation allows the complex three-dimensional capacitor structure to be fabricated using standard semiconductor processing techniques, reducing manufacturing complexity while maintaining voltage stability performance.
Solution Approach 2:
The patent replaces traditional mechanical assembly of separate capacitor components with a monolithic semiconductor fabrication process. The deep trench capacitors are formed in-situ within the substrate using etching and deposition processes, eliminating complex mechanical assembly steps and reducing manufacturing complexity while achieving stable voltage performance.
3Area of stationary object
If power components are embedded in substrate core, then real estate usage is reduced, but mechanical stability challenges arise
Solution Approach 1:
The substrate core is designed with localized regions of different properties: the internal cavity provides space for the capacitor while the surrounding substrate material maintains structural integrity. This local quality differentiation allows embedding of power components without compromising overall mechanical stability, as the substrate's rigid structure supports the embedded capacitor.
Solution Approach 2:
The patent employs composite construction by integrating the capacitor with the substrate core to form a unified hybrid structure. This composite approach combines the electrical functionality of the capacitor with the mechanical strength of the substrate, achieving both reduced real estate usage and maintained mechanical stability through the synergistic integration of different materials and functions.
Data Source
AI summary
Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. A spacer may be included between the power components. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.