Embedded Deep Trench Capacitor Stacks for Stable Package Power Delivery
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Solution Overview
Problem
High-power semiconductor dies require stable voltage and efficient power delivery, which is challenging due to the space and structural issues caused by traditional capacitor placement on circuit boards.
Innovation Solution
Embedding deep trench capacitors within the substrate core of a circuit board, utilizing through-silicon vias for connections, and stacking these capacitors to minimize height and provide a direct power path to the semiconductor die, thereby reducing real estate and mechanical instability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are placed on the same package as the dies, then power delivery stability is improved, but device complexity and real estate occupation increase
Solution Approach 1:
The capacitor is embedded within the substrate core, nesting the power component inside the existing substrate structure rather than adding it as a separate external component. This integrates the capacitor into the package interior, providing power delivery stability without increasing overall package complexity or occupying additional external real estate.
Solution Approach 2:
The invention transitions from traditional planar capacitor placement on the package surface to three-dimensional embedding within the substrate core. By utilizing the vertical dimension and internal substrate space, the capacitor is positioned close to the die for optimal power delivery stability while maintaining a compact package footprint.
2Use of energy by moving object
If deep trench capacitors are embedded in the substrate core, then power delivery efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The capacitor embedding structure is prepared in advance during substrate fabrication, with cavities and mounting positions predefined in the substrate core. This preliminary preparation simplifies the subsequent assembly process, allowing the capacitor to be directly installed into pre-formed structures rather than requiring complex post-assembly manufacturing steps.
3Object-affected harmful factors
If capacitors are placed near the dies, then power delivery noise is suppressed, but mechanical stability issues arise
Solution Approach 1:
The capacitor is nested within the substrate core structure, which provides rigid mechanical support and stable positioning. This embedding approach suppresses power delivery noise by placing the capacitor near the die while simultaneously improving mechanical stability through the substrate's structural integrity, eliminating the instability issues associated with surface-mounted capacitors.
4Length of moving object
If through-silicon vias are used for connections, then power delivery path length is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The through-silicon via positions and routing paths are predetermined during substrate design and fabrication. This preliminary establishment of via locations enables precise alignment with the capacitor and die connections, reducing the actual via formation and connection steps to simple filling and plating operations rather than complex alignment procedures.
Data Source
AI summary
Technologies for connected components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Through-silicon vias in some or all of the power components can allow for connections through one power component to another. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.