Embedded Component Carrier With Exposed Contacts for Low-Loss Interconnects
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Solution Overview
Problem
The increasing miniaturization and complexity of component carriers with multiple electronic components pose challenges in efficiently embedding and heat removal, while maintaining mechanical robustness and electrical reliability, especially under harsh conditions.
Innovation Solution
A laminated stack component carrier with exposed electrically conductive connection structures, such as copper pillars, is used to embed components like semiconductor chips, allowing direct electrical contacting and reducing signal losses by creating a compact vertical geometry with short electric paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are miniaturized and densely packed to increase functionality, then the number of components and contacts increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding components vertically within the laminated stack. This vertical embedding creates direct thermal pathways from component sources through the stack layers to external heat sinks, enabling efficient heat removal despite increased component density.
Solution Approach 2:
Components are nested within cavities formed in the laminated stack structure. This nesting approach allows multiple components to be embedded at different depths and positions within the stack, optimizing both space utilization and thermal management by positioning heat-generating components near thermal pathways.
2Volume of moving object
If components are embedded in the component carrier, then space is saved and compactness is achieved, but manufacturing complexity increases
Solution Approach 1:
Cavities for component embedding are pre-formed in the laminated stack before final assembly. This preliminary action simplifies the embedding process by providing ready-made receptacles for components, reducing manufacturing complexity while maintaining compactness.
Solution Approach 2:
The component carrier is segmented into multiple laminated layers with integrated cavities. This segmentation allows independent fabrication of stack layers and simplifies component embedding, as each layer can be prepared separately and then assembled into the final compact structure.
3Loss of energy
If conductive connection structures are exposed to create direct electrical contacting, then signal losses are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The conductive connection structures are nested within the laminated stack such that their exposed ends automatically align with the exterior main surface. This nested configuration ensures precise alignment without requiring additional post-processing steps, reducing manufacturing precision requirements while maintaining short electrical paths for low signal loss.
4Reliability
If the component carrier is made mechanically robust for harsh conditions, then reliability improves, but heat dissipation capability may be reduced
Solution Approach 1:
The laminated stack employs composite materials combining electrically insulating layers with electrically conductive layer structures. These composite structures provide both mechanical robustness for harsh conditions and integrated thermal pathways through the conductive layers, simultaneously achieving reliability and heat dissipation.
Solution Approach 2:
The conductive layer structures serve multiple functions: providing electrical connectivity, enabling heat dissipation pathways, and contributing to mechanical strength. This multi-functionality allows the component carrier to be mechanically robust while maintaining effective heat dissipation capability.
Data Source
AI summary
A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.