Embedded Component Carrier With Exposed Side Wall for Heat and Coupling
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Solution Overview
Problem
The increasing miniaturization and functionality of component carriers with embedded electronic components pose challenges in efficiently managing heat removal, mechanical robustness, and electrical reliability, particularly under harsh conditions, while maintaining compactness and functionality.
Innovation Solution
A method of manufacturing a component carrier involves forming a stack of conductive and insulating layer structures, embedding an optical component, and exposing a portion of its side wall by removing material from the stack to create an access recess, allowing for optical or electrical connections and sensor functionalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are miniaturized and densely packed to increase functionality, then the number of components and contacts increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent exposes the lateral side wall of the optical component to provide an additional dimension for heat dissipation and optical coupling, moving away from traditional top-only access approaches. This lateral exposure creates a new thermal and optical pathway that complements conventional heat management strategies.
2Adaptability or versatility
If material is removed from the stack to expose the side wall of the optical component, then optical and electrical connectivity is improved, but mechanical robustness is reduced
Solution Approach 1:
The patent selectively removes material only from specific regions to expose the optical component's side wall, rather than removing material from the entire structure. This targeted extraction approach minimizes the impact on overall mechanical strength while achieving the necessary optical and electrical access.
Solution Approach 2:
The exposure of the optical component's side wall is performed locally at specific positions where optical coupling is required, rather than uniformly across the entire component. This localized approach allows optical connectivity to be improved only where needed, preserving mechanical robustness in other critical areas.
3Strength
If the component carrier is designed to be mechanically robust for harsh conditions, then structural integrity is improved, but heat dissipation efficiency is reduced
Solution Approach 1:
By exposing the lateral side wall of the optical component, the patent introduces an additional dimension for heat dissipation pathways. This lateral exposure works in conjunction with the mechanically robust structure, providing alternative thermal routes that do not compromise structural integrity.
Data Source
AI summary
A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.