Embedded Component Carrier Assembly Without Vertical Through-Connections
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Solution Overview
Problem
Existing component carrier assemblies fail to adequately protect and securely fixate electronic components, often requiring additional processing steps and potentially exposing sensitive components to environmental factors.
Innovation Solution
A component carrier assembly is designed with a stack of electrically conductive and insulating layers, incorporating an adhesive profile that embeds the component, providing protection and improved stability while allowing direct electrical connections without vertical through-connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a component is attached to a carrier by soldering or gluing, then the component is fixed to the carrier, but the component is not adequately protected from environmental factors and lacks improved fixation stability
Solution Approach 1:
The component is fully embedded within the stack of layer structures, nesting the component inside the carrier assembly. This embedding provides comprehensive protection from environmental factors while maintaining secure fixation, resolving the contradiction between component exposure and fixation stability.
Solution Approach 2:
The invention transitions from surface-level attachment (2D) to three-dimensional embedding within the stack (3D). The adhesive profile extends vertically through the stack, providing fixation and protection in multiple dimensions, thereby improving reliability while reducing environmental exposure.
2Ease of manufacture
If vertical through-connections are used for electrical connections, then electrical connectivity is achieved, but the manufacturing process becomes more complex with additional processing steps
Solution Approach 1:
The invention extracts and eliminates the need for vertical through-connections from the design. Electrical connections are achieved through lateral connections within the same layer or adjacent layers, removing the complex drilling, plating, and routing operations associated with through-connections, thereby simplifying manufacturing.
Solution Approach 2:
The electrical connection path is segmented into lateral segments within the layer structure rather than requiring a single vertical through-path. This segmentation allows connections to be made through separate, simpler processes on individual layers that are then assembled together.
3Strength
If a component is embedded within the stack with an adhesive profile, then component protection and stability are improved, but the adhesive material and embedding process are required
Solution Approach 1:
The adhesive profile serves multiple functions simultaneously: it provides mechanical fixation strength, acts as a protective barrier, enables lateral electrical connections, and facilitates thermal management. This multi-functionality reduces the need for separate structures for each function, offsetting the complexity of the adhesive profile itself.
Solution Approach 2:
The adhesive profile is formulated as a composite material combining adhesive properties with conductive or protective characteristics. This allows a single material to provide both strong bonding and additional functions such as electrical connectivity or environmental protection, reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive profile enhances component protection and stability, simplifies manufacturing, and enables efficient electrical and thermal connections, reducing the need for additional processing steps and allowing for a more compact design.
Implementation Method 1
a - preferably continuously extending - adhesive profile is provided in the region of, preferably direct at, the first edge of the component
Implementation Method 2
The semi-cured resin may comprise organic polymeric material, for example epoxy resin, poly (meth)acrylate, polyethylene theraphthalate, polyimide
Data Source
Figure 1
Figure 2a~3b
Figure 4a~5b
AI summary
The invention relates to a component carrier assembly (1) with a component carrier (2) comprising a stack (4) of at least one electrically conductive layer structure (5) and at least one electrically insulating layer structure (6). It further comprises a component (10), preferably an electronic component, being at least partially embedded within the stack (4) and comprising a first main surface (11), a second main surface (12) opposed to the first main surface (11), and at least one lateral surface (13) connecting the first main surface (11) and the second main surface (12) with each other, wherein a first edge (14) is formed where the first main surface (11) and the at least one lateral surface (13) meet and a second edge (15) is formed where the second main surface (12) and the at least one lateral surface (13) meet. An adhesive profile (3) is provided in the region of the first edge (14) of the component (10).