Embedded Component Carrier With Pre-Connected Pillars for Dense Packaging
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Solution Overview
Problem
The challenge lies in efficiently embedding components within component carriers while ensuring mechanical robustness, electrical reliability, and effective heat dissipation, particularly as components become more miniaturized and densely packed.
Innovation Solution
A method of manufacturing a component carrier involves galvanically depositing electrically conductive pillars on components and inserting them into an electrically insulating layer structure, providing a robust and precise embedding solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are miniaturized and densely packed to increase functionality, then the number of components and contacts increases, but heat dissipation becomes increasingly difficult and mechanical robustness decreases
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding components vertically within the component carrier. Multiple layers of conductive pillars and thermal pathways are created in the vertical dimension, allowing heat to be conducted away from densely packed components through depth rather than only across the surface area.
Solution Approach 2:
The component carrier employs composite structures combining electrically conductive materials (for electrical connectivity) with thermally conductive materials (for heat dissipation). The conductive pillars and layer structures are designed to simultaneously provide both electrical connection and thermal management functions, resolving the contradiction between component density and heat dissipation.
2Productivity
If electronic components are miniaturized with smaller spacing between contacts, then component density increases, but manufacturing precision requirements become more stringent
Solution Approach 1:
Conductive pillars are pre-formed on component surfaces before embedding, establishing precise electrical connection points in advance. This preliminary structuring of conductive pathways allows for controlled, precise spacing that maintains manufacturing feasibility even as component density increases.
Solution Approach 2:
The patent changes the dimensional parameters of conductive structures from two-dimensional traces to three-dimensional pillars with specific height, diameter, and spacing parameters. This parameter transformation enables precise control over electrical connectivity and thermal conduction while maintaining manufacturability through standardized pillar geometries.
3Strength
If components are embedded deeper in the component carrier for better mechanical robustness, then structural stability improves, but electrical connectivity and heat dissipation efficiency decrease
Solution Approach 1:
Conductive pillars serve as intermediary structures that extend from the component surface through the embedding medium to establish electrical and thermal pathways. These pillars act as mediators that maintain electrical connectivity and heat dissipation efficiency even when components are embedded at optimal depths for mechanical robustness.
Solution Approach 2:
Components are nested within cavities of the component carrier, with conductive pillars nested within the embedding medium. This nested configuration allows components to be securely positioned for mechanical stability while conductive pathways are simultaneously established through the embedding material, maintaining both robustness and connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of component carriers with high positional accuracy and efficient electrical connectivity, addressing the challenges of miniaturization and heat management.
Implementation Method 1
galvanically depositing at least part of at least one electrically conductive pillar on a component
Implementation Method 2
the at least one electrically conductive pillar is formed by sputtering a base portion of a first material on the component
Data Source
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Figure 11~16
AI summary
A method of manufacturing a component carrier (100), wherein the method comprises galvanically depositing at least part of at least one electrically conductive pillar (104) on a component (102), and inserting the at least one electrically conductive pillar (104) and an electrically insulating layer structure (106) into one another.