Embedded Component Carrier With Double-Sided Thermal Blocks
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Solution Overview
Problem
Conventional component carriers face challenges in effective heat management, which is crucial for maintaining computing power as electronic components continue to miniaturize, leading to a need for improved thermal conductivity and electrical connectivity.
Innovation Solution
A component carrier design featuring a stack with embedded active components and double-sided thermally conductive blocks made of materials like copper or aluminum, which are also electrically conductive, allowing for efficient heat dissipation and signal transmission, along with an optional heat sink for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If active components are embedded in a stack to reduce component carrier size, then miniaturization and compactness are achieved, but heat management becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding thermally conductive blocks vertically within the multi-layer stack. These blocks extend through multiple conductive and insulating layers, creating thermal conduction paths in the vertical dimension that efficiently transport heat away from embedded active components while maintaining compact horizontal footprint.
Solution Approach 2:
Thermally conductive blocks serve as intermediary elements between embedded active components and external heat sinks or cooling structures. These blocks are strategically positioned to thermally couple with heat-generating components and conduct heat through the stack to external cooling mechanisms, effectively mediating the thermal management challenge in miniaturized configurations.
2Temperature
If thermally conductive blocks are added for heat management, then thermal conductivity improves, but device complexity increases
Solution Approach 1:
The thermally conductive blocks perform multiple functions simultaneously: they provide thermal conduction pathways for heat dissipation, serve as structural support elements within the stack, and can be integrated with existing conductive layers for electrical connectivity. This multi-functionality reduces overall device complexity by combining several roles into single components.
Solution Approach 2:
The patent merges thermal management functions with existing structural and electrical components of the stack. Thermally conductive blocks are integrated into the multi-layer construction, combining thermal conduction with mechanical support and electrical connectivity functions, thereby avoiding the need for separate dedicated cooling structures that would increase complexity.
3Reliability
If conventional surface finishes completely cover the exposed copper surface, then electrical insulation is improved, but heat dissipation capability is reduced
Solution Approach 1:
Instead of applying uniform surface finishes across all copper surfaces, the patent implements selective surface treatment where only specific exposed copper areas receive insulating coatings. Regions requiring heat dissipation maintain exposed copper surfaces for thermal conduction, while areas requiring electrical insulation receive appropriate finishes. This local differentiation optimizes both electrical insulation and thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal conductivity and current carrying capabilities while maintaining a compact and cost-effective solution, supporting high-power applications with improved heat transfer and electrical isolation.
Implementation Method 1
The heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block or via both, the first thermally conductive block and the second thermally conductive block
Data Source
Figure 1~2
Figure 3
AI summary
The present invention relates to a component carrier (100) comprising a stack (101) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component (102) embedded in the stack (101); a first thermally conductive block (103) above and thermally connected with the component (102), and a second thermally conductive block (104) below and thermally coupled with the component (102). The heat generated by the component (102) during operation is removed via at least one of the first thermally conductive block (103) and the second thermally conductive block (104).