Embedded Ceramic Capacitor Stacking for Stable Package Power
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Solution Overview
Problem
High-power semiconductor dies require stable voltage supply, and existing capacitors often occupy significant space and cause mechanical instability due to mismatched heights with the substrate core.
Innovation Solution
Embed deep trench capacitors and multi-layer ceramic capacitors within the substrate core's cavity, stacking them to match the core's height, providing a stable voltage supply while reducing real estate and mechanical instability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are placed near the semiconductor dies on the same package, then power delivery performance is improved, but the space occupied by capacitors increases
Solution Approach 1:
The patent transitions from planar capacitor placement on the package surface to three-dimensional embedding within the substrate core. Deep trench capacitors utilize vertical etching to create capacitive structures that extend through the substrate thickness, while MLCCs are stacked vertically within the core cavity. This dimensional transition allows capacitors to be positioned in the Z-direction (vertical) rather than only in the XY-plane, significantly reducing the footprint area while maintaining proximity to the semiconductor die for effective power delivery noise suppression.
2Reliability
If traditional capacitors are used, then power delivery noise suppression is achieved, but mechanical instability occurs due to height mismatch with substrate core
Solution Approach 1:
The patent modifies the height parameter of capacitors to match the substrate core thickness. Deep trench capacitors are formed by etching trenches to a specific depth that corresponds to the substrate thickness, ensuring the capacitor height equals the core height. MLCCs are selected or trimmed to match the core height dimension. This parameter alignment eliminates the need for filler materials and prevents mechanical instability caused by height mismatches, while maintaining the capacitors' ability to suppress power delivery noise.
3Area of stationary object
If capacitors are embedded in substrate core, then space efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the capacitor embedding process into distinct segments: deep trench capacitors are formed through separate etching and filling processes, while MLCCs are placed in dedicated core cavities. This segmentation allows each capacitor type to be manufactured and integrated using optimized, independent processes rather than attempting to embed all capacitors through a single complex method. The segmentation simplifies manufacturing by enabling parallel processing and reducing the complexity of any single embedding operation.
Data Source
AI summary
Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors and multi-layer ceramic capacitors (MLCCs) are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.