Embedded Multilayer Ceramic Component Electrodes With Lower Step Height
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Solution Overview
Problem
The existing methods for embedding multilayer ceramic electronic components in boards face challenges in maintaining the thickness of the ceramic body while forming external electrodes with sufficient length, leading to weakened chip strength and increased delamination probabilities due to thick external electrodes and large step generation.
Innovation Solution
The solution involves forming conductive thin film layers on the ceramic body's surfaces, which serve as plating seed layers for external electrodes, allowing for a thinner band surface formation with a predetermined length, thereby reducing the overall thickness of the external electrodes and increasing the ceramic body's thickness, using materials like copper, nickel, or silver, and ensuring a thickness ratio of 1.5≤tp/tf≤10000 for effective plating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the band surface of the external electrode is formed to have a predetermined length or greater using existing dipping method, then the external electrode can be electrically connected to external wiring through via hole, but the thickness of the external electrode becomes thick, such that the thickness of the ceramic body becomes extremely small and chip strength becomes weak
Solution Approach 1:
The external electrode is segmented into multiple functional layers: a base electrode layer formed by dipping method, an intermediate conductive layer formed by screen printing, and an outer plating layer. This segmentation allows each layer to perform its specific function optimally - the base electrode provides electrical connection, the intermediate layer provides a flat band surface, and the outer layer provides corrosion resistance and solderability, while keeping the overall thickness controlled
Solution Approach 2:
Different regions of the external electrode structure are given different properties: the base electrode layer has high electrical conductivity for connection, the intermediate conductive layer has a flat surface topology for mechanical stability, and the plating layer has corrosion resistance. This local differentiation of properties allows the electrode to meet multiple requirements simultaneously without increasing overall thickness
2Reliability
If the band surface of the external electrode is formed to have a predetermined length or greater, then electrical connection to external wiring is achieved, but a large step is generated between the ceramic body and external electrode, such that gap between the multilayer ceramic electronic component and film becomes large and occurrence probability of de-lamination is increased
Solution Approach 1:
The intermediate conductive layer is formed on the base electrode layer before the final plating layer is applied. This preliminary action creates a flat band surface that prevents large step generation between the ceramic body and external electrode, thereby reducing the gap between the component and surrounding film and decreasing de-lamination probability
Solution Approach 2:
The intermediate conductive layer acts as a mediator between the base electrode layer and the outer plating layer. It provides a flat band surface that reduces the step height, thereby mediating the mechanical stress distribution and reducing the gap between the component and surrounding film, which prevents de-lamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the strength of the multilayer ceramic electronic component by maintaining a sufficient ceramic body thickness while reducing the external electrode thickness, minimizing delamination risks and ensuring the component's integrity within the board.
Implementation Method 1
plating layers formed on the first and second base electrodes and the conductive thin film layers
Data Source
AI summary
There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for an increase in a thickness of an external electrode while forming a band surface of the external electrode to have a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, such that chip strength may be improved and the occurrence of damage such as breakage, or the like may be prevented, and a manufacturing method thereof, may be provided.