Embedded Ceramic Component Substrate for Oxidation-Resistant Connections
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Solution Overview
Problem
The miniaturization of electronic devices has led to challenges in maintaining the integrity of ceramic electronic components, as metal oxide formation on external electrodes can deteriorate the electrical connection between the components and the substrate, especially in environments with moisture and oxygen, causing connection resistance issues.
Innovation Solution
A component built-in substrate design featuring a multilayer ceramic electronic component with protruding connection portions covered by a core material, which are embedded in the substrate, reducing exposure and oxidation, and utilizing Cu-plated layers for improved connection resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrode is exposed on the substrate surface for connection, then the electrical connection is accessible, but metal oxide formation deteriorates the connection resistance
Solution Approach 1:
The patent applies the inert atmosphere principle by using a resin layer to create a protective environment around the external electrode and via hole conductor. This resin layer acts as a barrier that prevents oxygen and moisture from reaching the metal surfaces, thereby preventing metal oxide formation while maintaining electrical connection stability. The encapsulation creates a localized inert environment that protects the vulnerable connection interfaces during shipping and storage.
Solution Approach 2:
The patent employs the intermediary principle by introducing a resin layer as a mediating substance between the external electrode/via hole conductor and the external environment. This resin layer serves as a protective intermediary that blocks harmful oxygen and moisture while allowing the electrical connection to function. The intermediary layer resolves the contradiction by providing physical protection without interfering with the electrical connection.
2Volume of moving object
If the ceramic electronic component is miniaturized, then the electronic device can be miniaturized, but the component becomes more susceptible to oxidation and connection deterioration
Solution Approach 1:
The resin layer creates a protective inert environment that scales with the miniaturized component. Even as the component size decreases, the encapsulation maintains a consistent protective barrier that prevents oxidation. This is particularly important for miniaturized components where the surface area to volume ratio increases, making them more vulnerable to environmental degradation.
Solution Approach 2:
The patent applies beforehand cushioning by pre-encapsulating the external electrode and via hole conductor in the resin layer before potential oxidation can occur. This protective measure is in place prior to any exposure to harmful environments during shipping or storage, providing advance protection against connection deterioration that would otherwise affect miniaturized components more severely.
3Reliability
If the external electrode is covered to prevent oxidation, then connection resistance is reduced, but the connection portion cannot be accessed for wiring
Solution Approach 1:
The patent applies segmentation by dividing the component into distinct functional zones: the external electrode and via hole conductor are encapsulated in the resin layer for protection, while the protruding connection portions remain accessible for wiring. This spatial segmentation allows simultaneous achievement of oxidation protection and wiring accessibility, resolving the contradiction between connection resistance and ease of operation.
Solution Approach 2:
The patent employs local quality by providing differential protection: the resin layer covers only the vulnerable external electrode and via hole conductor surfaces that are prone to oxidation, while leaving the connection portions that need to be accessed for wiring exposed. This localized approach ensures protection where needed without compromising accessibility where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the formation of metal oxide and maintains stable electrical connections by keeping the external electrodes and connection portions non-exposed, thereby enhancing the reliability and longevity of the electronic components.
Implementation Method 1
If a metal oxide is present on the surface of the external electrode when the ceramic electronic component is embedded in the substrate, the connection resistance is deteriorated between the external electrode and the via hole conductor to be provided in subsequent processing. In order to prevent this, it is necessary to reduce or prevent the formation of metal oxide on the surface of the external electrode.
Data Source
AI summary
A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.