Embedded Ceramic Substrate Copper Patterns Warpage Thermal Resistance
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Solution Overview
Problem
The existing metal-ceramic bonded substrates face issues with warpage and thermal resistance due to the difference in thermal expansion coefficients between the metal base plate and ceramic substrate, leading to reduced performance and increased thermal resistance, especially in larger semiconductor devices.
Innovation Solution
The semiconductor apparatus incorporates an embedded ceramic substrate with upper and lower surface metal patterns made of high thermal conductivity materials, such as copper, bonded to the ceramic substrate, which enhances heat dissipation while minimizing warpage by covering the ceramic substrate with a metal base plate and optimizing the thickness and arrangement of these patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a reinforcement formed of ceramics is inserted in the metal base plate to suppress warpage, then warpage control is improved, but thermal resistance deteriorates because the thermal conductivity of ceramics is smaller than that of the metal base plate
Solution Approach 1:
The invention uses a composite structure combining metal base plate, ceramic substrate, and copper patterns. The copper patterns are embedded in the ceramic substrate to create a hybrid material system that leverages the high thermal conductivity of copper while maintaining the mechanical stability provided by the ceramic-metal composite structure.
Solution Approach 2:
The invention applies local quality by placing high thermal conductivity copper patterns specifically in regions where heat dissipation is most critical, rather than uniformly thickening the entire reinforcement. This allows targeted thermal management while minimizing overall thermal resistance impact.
2Stability of the object's composition
If the reinforcement is thickened to suppress warpage in larger semiconductor devices, then warpage control is improved, but thermal resistance further deteriorates
Solution Approach 1:
The invention replaces homogeneous thick ceramic reinforcement with a composite structure where thin ceramic substrate is combined with high thermal conductivity copper patterns. This composite approach provides mechanical strength through the ceramic-metal combination while copper pathways maintain efficient heat transfer, avoiding the thermal resistance penalty of thickening pure ceramic reinforcement.
Solution Approach 2:
The invention changes the material composition parameter by introducing copper patterns with thermal conductivity significantly higher than both ceramic and standard metal base plate materials. This parameter change allows achieving warpage suppression without the thermal resistance deterioration that would result from increasing reinforcement thickness.
3Stability of the object's composition
If a metal-ceramic bonded substrate is used to control warpage, then structural stability is improved, but heat dissipation capability deteriorates due to high thermal resistance
Solution Approach 1:
The invention creates a three-layer composite structure (metal base plate + ceramic substrate with copper patterns + upper metal layer) that combines the advantages of each material. The ceramic provides structural stability and electrical insulation, while embedded copper patterns provide high thermal conductivity pathways, and metal layers provide mechanical strength and additional thermal management.
Solution Approach 2:
The copper patterns act as thermal intermediaries, conducting heat from the semiconductor device through the ceramic substrate to the metal base plate. This intermediary copper layer bridges the thermal gap between the low thermal conductivity ceramic and the heat sink metal base plate, enabling efficient heat dissipation while maintaining structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses warpage and improves thermal resistance, allowing for enhanced heat dissipation and extended device lifetime by using materials with higher thermal conductivity than the metal base plate, thereby optimizing the performance of semiconductor devices.
Implementation Method 1
a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate
Implementation Method 2
the difference in thermal expansion coefficient between the metal base plate and the ceramic substrate provided on the metal base plate
Data Source
AI summary
A semiconductor apparatus includes a metal base plate, an upper surface ceramic substrate provided on an upper surface of the metal base plate, a semiconductor device provided on the upper surface ceramic substrate, and a substrate that is provided in the metal base plate and includes an embedded ceramic substrate, an upper surface metal pattern provided on an upper surface of the embedded ceramic substrate, and a lower surface metal pattern provided on a lower surface of the embedded ceramic substrate, wherein a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate.