Embedded Ceramic Waveguide Structure for Thermal Stress Relief
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Solution Overview
Problem
Waveguides are bulky and have different thermal expansion coefficients than circuit boards, leading to stress and reduced performance over time.
Innovation Solution
A waveguide embedded within a substrate with conductive walls formed on the inner surfaces of the substrate's channel, using cofired ceramic to minimize thermal expansion issues and optimize space usage, along with a method of manufacturing involving stacked dielectric layers and conductive material deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If waveguides are made as discrete metal components attached to circuit boards, then waveguide functionality is achieved, but the device occupies valuable space and creates thermal expansion stress
Solution Approach 1:
The waveguide is merged with the substrate by embedding it within the substrate structure. The conductive walls are formed on inner surfaces of channels within the substrate, integrating the waveguide functionality directly into the substrate rather than using separate discrete components. This eliminates the need for external attachments and reduces overall device volume.
Solution Approach 2:
The substrate is made of cofired ceramic material that provides both structural support and waveguide functionality. The composite structure combines the substrate material with conductive wall materials to create an integrated waveguide system that matches thermal expansion properties and eliminates stress at connection points.
2Reliability
If waveguides are made from metal components, then waveguide functionality is achieved, but thermal expansion mismatch causes stress at connection points
Solution Approach 1:
The substrate and waveguide structure use cofired ceramic material that provides homogeneous thermal expansion properties throughout the entire assembly. This eliminates the thermal expansion mismatch between different materials that would otherwise cause stress at connection points between waveguides and circuit boards.
Solution Approach 2:
The use of cofired ceramic composite material creates a unified structure where the substrate and waveguide components share the same thermal expansion characteristics. This composite approach ensures that thermal cycling does not create differential expansion and contraction that would lead to connection failure.
3Volume of moving object
If waveguides are embedded within substrate, then space efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The waveguide structure is segmented into multiple conductive walls formed on separate inner surfaces of channels within the substrate. This segmentation allows for modular manufacturing where each wall can be independently formed and then integrated, simplifying the overall manufacturing process while maintaining the embedded configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded waveguide design enhances space efficiency and robustness, improving the longevity of connections between circuit components and waveguides by reducing thermal stress.
Implementation Method 1
heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide
Implementation Method 2
the substrate may comprise cofired ceramic, so expansion due to varying coefficients of thermal expansion will not be as pronounced
Data Source
AI summary
Waveguides and methods for manufacturing a waveguide that include forming a first channel in a first layer of dielectric material, the first channel comprising one or more walls; forming a second channel in a second layer of dielectric material, the second channel comprising one or more walls; depositing electrically conductive material on the one or more walls of the first channel; depositing electrically conductive material on the one or more walls of the second channel; arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide.