Embedded Chip Recess Structure for Heat Dissipation and Warpage Control
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Solution Overview
Problem
The semiconductor integrated circuits (ICs) generate heat during operation, which affects their quality and thickness, necessitating improved structural adjustments to enhance heat dissipation and reduce warpage.
Innovation Solution
A semiconductor structure with a recessed conductive layer and a thermally conductive adhesion layer to facilitate heat dissipation, combined with a conductive path and encapsulant to embed a chip, allowing for efficient thermal coupling and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the IC structure is adjusted to improve heat dissipation, then heat dissipation efficiency is improved, but structural complexity increases
Solution Approach 1:
The patent embeds a recessed conductive layer within the IC structure, creating a nested configuration where the conductive layer is positioned inside a recess formed in the substrate. This nesting approach improves heat dissipation by providing a dedicated thermal pathway without significantly increasing overall structural complexity, as the conductive layer integrates within existing structural boundaries.
Solution Approach 2:
The patent introduces a vertical dimension to heat dissipation by forming a recess in the substrate and positioning a conductive layer within it. This three-dimensional configuration allows heat to be conducted away from the IC in the vertical direction, adding a new thermal management dimension without requiring proportional increases in horizontal structural complexity.
2Length of stationary object
If the IC thickness is reduced, then compactness is improved, but warpage increases
Solution Approach 1:
The patent applies local quality by creating a recess in a specific region of the substrate and filling it with a conductive layer that has optimized thermal properties. This localized structural modification allows for thickness reduction in specific areas while maintaining overall structural stability and reducing warpage through the strategic placement of materials with appropriate mechanical and thermal properties.
Solution Approach 2:
The patent employs composite materials by combining the substrate material with a recessed conductive layer having different thermal and mechanical properties. This composite structure allows the IC to achieve reduced thickness while the contrasting material properties of the conductive layer help compensate for thermal stress and reduce warpage.
3Temperature
If a recessed conductive layer is added for heat dissipation, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the recess in the substrate before depositing the conductive layer. This sequence allows the recess structure to be prepared in advance, providing a predefined pathway for subsequent conductive layer deposition and ensuring proper thermal contact without requiring complex post-processing steps.
Solution Approach 2:
The patent segments the heat dissipation function by separating it into distinct components: the recess structure and the conductive layer. This segmentation allows each component to be manufactured using optimized processes for its specific function, with the recess providing structural integration and the conductive layer providing thermal conduction, thereby managing manufacturing complexity through functional decomposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thinner and more efficient heat dissipation mechanism, reducing warpage and improving process quality by enhancing thermal conductivity and electromagnetic interference reduction.
Implementation Method 1
A portion of the conductive layer forms a heat dissipation path to conduct heat away from the chip
Implementation Method 2
The chip is thermally coupled to the heat dissipation path through the adhesion layer
Data Source
AI summary
An electronic component including a first circuit structure and a chip is provided. The first circuit structure has a recess. The chip is disposed on the first circuit structure and embedded in the recess. The first circuit structure comprises a conductive layer. A portion of the conductive layer forms a portion of a heat dissipation path partially located or exposed in the recess. The chip is thermally coupled to the heat dissipation path.