Embedded Chip Identification via Directed Self-Assembly
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Solution Overview
Problem
Current chip identification methods using MAC addresses are not secure against duplication and brute force attempts, as they rely on known identification values.
Innovation Solution
A security region with parallel conductive lines of specific widths and bends, formed using directed self-assembly block copolymers, creates a unique physical and electronic fingerprint by generating random continuous and discontinuous patterns that can be read as logical '0's and '1's, providing a unique MAC address-like code.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If known identification values (MAC addresses) are assigned to chips, then chip identification is enabled, but security against duplication and brute force attempts is insufficient
Solution Approach 1:
The system uses the inherent randomness of manufacturing variations (line width, bend angle, continuity) to automatically generate unique identification patterns without human intervention. Each chip's security region self-generates its unique fingerprint through the physical characteristics of conductive lines formed during manufacturing, eliminating the need for external assignment of identification values.
Solution Approach 2:
The patent transforms physical manufacturing parameters (conductive line width, bend angle, continuity) into identification information. By measuring these physical parameters that naturally vary during manufacturing, the system generates unique digital fingerprints. This converts uncontrollable manufacturing variations into useful security features rather than defects.
2Manufacturing precision
If sub-lithography patterning with directed self-assembly is used to form conductive lines, then unique physical fingerprints are generated, but manufacturing process complexity increases
Solution Approach 1:
The patent replaces traditional lithographic patterning (mechanical/optical system) with directed self-assembly of block copolymers (chemical self-organizing system). Instead of using lithography tools to draw patterns, the system uses chemical processes where block copolymers spontaneously form the desired nanoscale patterns through phase separation, guided by guiding structures but formed through self-organization rather than direct mechanical patterning.
Solution Approach 2:
The patent introduces block copolymers as intermediary materials that mediate between the guiding structures and the final conductive line patterns. The block copolymers form temporary sacrificial structures during manufacturing that define the conductive line patterns, then are removed to leave the desired metal line configurations. This intermediary approach enables sub-lithography precision without requiring direct lithographic patterning at that scale.
3Reliability
If random continuous and discontinuous patterns are generated in security regions, then unique electronic fingerprints are created, but measurement and detection difficulty increases
Solution Approach 1:
The patent creates a physical copy of the random pattern in the security region that can be read and detected. The conductive lines form a tangible representation of the unique fingerprint that can be measured using standard electrical testing equipment. By encoding the unique pattern into physical conductive structures, the system enables detection through electrical continuity measurements rather than requiring direct observation of the manufacturing variations themselves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution generates a highly secure and unique electronic fingerprint that is difficult to duplicate, effectively preventing brute force attempts and ensuring secure chip identification.
Implementation Method 1
the block copolymer includes at least two components that phase separate into at least two distinct material regions
Implementation Method 2
forming a block copolymer in each of the guiding trenches, wherein the block copolymer includes at least two components that phase separate into at least two distinct material regions
Data Source
AI summary
A security region is provided. The security region includes a plurality of parallel conductive lines on a substrate, wherein each of the parallel conductive lines has a width and includes a bend, and wherein at least a portion of the plurality of parallel conductive lines is discontinuous, and an electrically insulating material between each adjacent pair of parallel conductive lines.