Embedded Chip Package Assembly With Bidirectional Heat Dissipation
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Solution Overview
Problem
High-density chip package assemblies face significant heat dissipation challenges, leading to safety hazards due to ineffective heat management.
Innovation Solution
A chip package assembly design featuring a package substrate with upper and lower conductive layers and a conductive part surrounding the chip, along with a heat dissipation part connected to the upper conductive layer, enabling bidirectional heat dissipation through the front and back electrodes, and an integrated heat dissipation structure to enhance thermal conductivity and exchange surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a high-density integrated embedded package is used to achieve compactness and miniature, then the integration degree is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent pathways: front electrode heat dissipation, back electrode heat dissipation, and conductive part heat dissipation. This segmentation allows heat to be dispersed through multiple channels simultaneously, resolving the contradiction between compact packaging and effective heat dissipation.
Solution Approach 2:
The patent transitions from traditional single-sided heat dissipation to three-dimensional bidirectional heat dissipation by utilizing both the front and back surfaces of the chip. The heat dissipation part extends in multiple spatial dimensions, increasing the heat exchange surface area within the compact package volume.
2Stability of the object's composition
If the chip is embedded in the package substrate with conductive layers, then the structural stability is improved, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The conductive layers and conductive part serve dual functions: providing structural support for chip embedding and serving as heat conduction pathways. This multi-functionality resolves the contradiction by making the structural components also responsible for heat dissipation, eliminating the need for separate heat dissipation structures.
Solution Approach 2:
The patent merges the structural support function and heat dissipation function into a unified conductive system. The upper conductive layer, lower conductive layer, and conductive part form an integrated heat dissipation network that simultaneously provides mechanical support and thermal management.
3Temperature
If a heat dissipation part is added to enhance heat dissipation, then the thermal management is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation part is designed to perform multiple functions: heat conduction from the chip, structural support for the upper conductive layer, and electromagnetic shielding. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while improving heat dissipation.
4Object-affected harmful factors
If the conductive part surrounds the chip to provide electromagnetic shielding, then the electromagnetic shielding capability is improved, but the heat dissipation path is restricted
Solution Approach 1:
The conductive part is designed as a multi-functional component that simultaneously provides electromagnetic shielding through its surrounding structure and heat dissipation through its thermal conduction properties. The same conductive material and structure serve both protective and thermal management functions, resolving the apparent contradiction between shielding and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective heat dissipation, reducing safety hazards and improving the chip package assembly's thermal management, structural stability, and electromagnetic shielding capabilities.
Implementation Method 1
The upper conductive layer, the lower conductive layer, and the conductive part each have a heat-conducting property. It can be understood that, the conductive part, the lower conductive layer, and the upper conductive layer each have the heat-conducting property, to effectively conduct heat generated by the chip, thereby implementing a heat dissipation function.
Implementation Method 2
The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. It can be understood that, compared with the upper conductive layer, the heat dissipation part has a larger heat exchange surface area, and therefore has a relatively strong heat dissipation function.
Data Source
Figure 1a~1c
Figure 1d~1e
Figure 2~3
AI summary
This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer. The chip includes a front electrode and a back electrode that are disposed opposite to each other, the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer. The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. The upper conductive layer, the lower conductive layer, and the conductive part each have a heat-conducting property. In this application, the chip is connected to the upper conductive layer and the lower conductive layer of the package substrate, so that heat generated by the chip can be bidirectionally conducted for heat dissipation. Further, the heat dissipation part is disposed on the upper conductive layer, so that the chip package assembly can achieve a better heat dissipation effect.