Pressure Sensor with Embedded Chip for Fluid-Leak Prevention
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Solution Overview
Problem
The existing pressure sensors face issues of decreased sensitivity and fluid leakage due to tensile stress generated at the bonding portion when exposed to fluid pressure, leading to potential peeling off of the sensor chip from the housing.
Innovation Solution
The pressure sensor incorporates a strain transmission material that embeds the entire sensor chip, with a pressure-receiving surface in contact with the fluid flow channel and a bonding surface fixed to the housing, preventing tensile stress and ensuring the chip remains bonded even under pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sensor chip is bonded directly to the housing with the bonding portion and pressure-receiving portion in the same direction, then the structure is simple and easy to manufacture, but tensile stress is generated in the bonding portion when fluid pressure is applied, causing peeling off and fluid leakage
Solution Approach 1:
A strain transmission member is introduced as an intermediary component between the sensor chip and the housing. This member includes a pressure-receiving portion that contacts the fluid and a bonding portion that bonds to the sensor chip, positioned at different locations. The intermediary structure transmits strain from the fluid pressure to the sensor chip without generating tensile stress at the bonding interface, thereby preventing peeling off while maintaining manufacturing simplicity.
2Device complexity
If the bonding portion and pressure-receiving portion are positioned in the same direction, then the device structure is compact, but the bonding portion is exposed to fluid pressure causing tensile stress and potential peeling
Solution Approach 1:
The strain transmission member extends in the depth direction (vertical dimension) of the sensor chip, with the pressure-receiving portion positioned at one end and the bonding portion at the other end. This dimensional arrangement allows the bonding portion to be positioned away from the fluid pressure zone while still transmitting strain effectively, reducing tensile stress on the bonding interface while maintaining compactness.
3Measurement precision
If the sensor chip is directly bonded to the housing, then the sensitivity is high due to direct strain transmission, but the bonding portion peels off under fluid pressure causing sensitivity loss
Solution Approach 1:
The strain transmission member serves as a mediator that transmits strain from the fluid pressure to the sensor chip. Although it introduces an additional component, the member is designed to efficiently transmit strain while preventing tensile stress at the bonding interface. This ensures both high sensitivity through effective strain transmission and high reliability by preventing bonding portion peeling under fluid pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents sensitivity loss and fluid leakage by maintaining the sensor chip's bond with the housing, enhancing reliability and sensitivity.
Implementation Method 1
a strain transmission material provided inside the housing. The strain transmission material includes a pressure-receiving surface in contact with the space, and a bonding surface positioned at an opposite side of the strain transmission material from the pressure-receiving surface and fixed to an inner surface of the housing
Data Source
AI summary
The present invention provides a pressure sensor in which a decrease in sensitivity or leakage of a fluid can be prevented even when the pressure sensor receives pressure from the fluid. This pressure sensor according to the present invention comprises a housing having a space inside that is a fluid flow channel, a sensor chip that comprises a strain detection part and is constituted from a thin-film semiconductor, and a strain transmission material that is provided inside the housing. The strain transmission material comprises a pressure-receiving surface in contact with the space that is a flow channel, and a bonding surface that is positioned on the opposite side of the strain transmission material from the pressure-receiving surface and is fixed to an inside surface of the housing. The entire sensor chip is embedded inside the strain transmission material.