Embedded Chip Resistor Mounting Structure for Thin Heat-Dissipating Layouts
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Solution Overview
Problem
Conventional chip resistors have limitations in achieving a reduced thickness and improved heat dissipation performance due to the need for thick electrodes, which affects their overall strength and efficiency in electronic applications.
Innovation Solution
A chip resistor design featuring an insulating substrate with a resistor embedded within, where the first and second electrodes are spaced apart in a direction perpendicular to the substrate's thickness, and an electroconductive bonding portion between the chip resistor and mounting substrate, facilitating reduced thickness and enhanced heat dissipation through a high heat conductance insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the plate-shaped electrodes are made thick to ensure appropriate strength, then the strength is improved, but the thickness of the chip resistor cannot be reduced
Solution Approach 1:
The patent transitions from conventional planar electrode arrangement to a three-dimensional stacked configuration where electrodes are arranged in multiple layers above and below the substrate. This vertical stacking in the thickness direction enables reduced electrode thickness while maintaining overall structural strength through distributed support across multiple layers.
Solution Approach 2:
The patent employs composite electrode structures combining multiple material layers including conductive materials, insulating materials, and bonding materials. This composite approach allows thin electrodes to achieve sufficient mechanical strength and electrical conductivity through optimized material composition and layering.
2Reliability
If conventional thick electrodes are used, then structural integrity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The patent arranges multiple electrode layers in the vertical dimension, creating multiple heat dissipation pathways from the substrate to the electrodes. This three-dimensional electrode configuration increases the effective heat dissipation surface area and reduces thermal resistance, enabling improved heat dissipation while maintaining structural integrity through the distributed layered structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the formation of chip resistors with reduced thickness and improved heat dissipation performance, preventing overheating and enhancing their operational efficiency in electronic devices.
Implementation Method 1
an electroconductive bonding portion disposed between the mounting substrate and the chip resistor
Data Source
AI summary
A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.