Embedded-Chip Sensor Layout for Substrate Miniaturization
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Solution Overview
Problem
Current micro sensors face challenges in miniaturization due to the space occupied by substrates, which limits the available space for other components in electronic devices, necessitating a reduction in substrate size to enhance manufacturing efficiency and reduce costs.
Innovation Solution
A micro sensor design that includes a substrate with a plate-like shape, embedded chips, and sensing elements connected via an interconnect structure, featuring a through hole with varying segments to reduce substrate thickness and allow for miniaturization, along with the integration of passive elements and multiple sensing elements on opposite sides of the substrate to optimize space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the substrate size is reduced to minimize space occupation, then the available space for other components increases, but the structural integrity and sensing accuracy may deteriorate
Solution Approach 1:
The patent transitions from a planar substrate layout to a three-dimensional stacked architecture where sensing elements, chips, and interconnect structures are arranged in multiple layers along the vertical dimension. This allows the substrate footprint to be minimized while maintaining adequate spacing and structural integrity through vertical separation of components.
Solution Approach 2:
The patent embeds chips within the substrate and positions sensing elements above them, creating a nested configuration where smaller components are integrated within or upon larger structures. The interconnect structures penetrate through the substrate to electrically connect embedded chips with surface-mounted sensing elements, achieving compact integration without compromising functionality.
2Adaptability or versatility
If multiple sensing elements and chips are integrated on the substrate, then sensing functionality is enhanced, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the sensor system into distinct functional modules: sensing elements for signal generation, embedded chips for signal processing, and interconnect structures for electrical coupling. Each module is independently designed and positioned in specific layers, allowing modular manufacturing and assembly while achieving complex sensing capabilities.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, houses embedded chips, carries interconnect structures, and positions sensing elements. The interconnect structures perform dual roles as both electrical conduits and structural anchors, reducing the need for separate components and simplifying the overall device architecture.
Data Source
AI summary
A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.