Embedded Thermoelectric Cooling for Low-Resistance Chip Stacks
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Solution Overview
Problem
Current cooling systems for microelectronic devices face inefficiencies due to high thermal resistance and unwanted heat transfer between components, which hampers energy efficiency and performance as energy consumption and thermal flux increase with advanced chip designs.
Innovation Solution
Integrated cooling assemblies are embedded within device packages, featuring a cold plate directly bonded to semiconductor devices without thermal interface materials, and a coolant channel between the cold plate and package cover to reduce thermal resistance and prevent heat transfer between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface materials are used to couple the chip to heat dissipation devices, then thermal contact is maintained, but thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The patent removes thermal interface materials from the thermal path between the chip and heat dissipation devices. By directly bonding the cold plate to the chip substrate, the intermediary thermal interface material is extracted from the system, eliminating its thermal resistance and improving cooling efficiency while maintaining reliable thermal contact through direct bonding.
2Loss of energy
If heat dissipation devices are thermally coupled to the chip, then heat transfer is facilitated, but thermal resistance at interfacial boundaries inhibits heat transfer
Solution Approach 1:
The patent merges the chip substrate and cold plate into a single integrated structure through direct bonding. This consolidation eliminates the separate thermal interface material layer and its associated thermal resistance, creating a unified thermal path that improves heat transfer while maintaining reliable thermal contact between the chip and heat dissipation devices.
3Temperature
If cooling systems are added to manage thermal flux, then chip temperature is controlled, but energy consumption increases
Solution Approach 1:
The patent converts the harmful thermal resistance of interface materials into a benefit by removing it entirely. By eliminating the thermal barrier, the system achieves more efficient passive heat dissipation, reducing the energy required for active cooling while maintaining proper chip temperature control through the direct thermal path provided by the integrated cold plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal resistance and heat transfer between devices, enhancing energy efficiency and performance by allowing direct heat transfer from semiconductor devices to a coolant, thereby improving cooling efficiency.
Implementation Method 1
a cold plate having a first side attached to the semiconductor device and a second side opposite the first side... directly bonded to the semiconductor device without thermal interface materials
Implementation Method 2
one or more surfaces of second side of the cold plate may be spaced apart from the package cover to define a coolant channel therebetween
Data Source
AI summary
In some implementations, a device may include a thermoelectric cooler disposed embedded or integrally formed in one or more chips in arranged in a hybrid bonded device stack.