Embedded Chip Substrate Crack Suppression via Self-Service Reinforcement
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Solution Overview
Problem
Existing semiconductor modules face issues with crack occurrence due to reinforcement requirements and cavity formation, which affect the mounting area and reliability of electronic components.
Innovation Solution
A component-embedded substrate design featuring a resin substrate with embedded chip-type electronic components arranged to extend across specific regions, providing reinforcement and reducing stress concentrations, thereby suppressing crack formation without the need for additional reinforcement members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reinforcement portion is provided in the peripheral portion of the substrate, then crack occurrence is suppressed, but the area where electronic components can be mounted is reduced
Solution Approach 1:
The chip-type electronic component embedded in the resin substrate serves dual functions: it performs its electronic function while simultaneously acting as a reinforcement element that suppresses cracks in the resin substrate. The component's own structure and positioning provide the reinforcement effect, eliminating the need for separate reinforcement portions that would reduce mounting area.
2Device complexity
If a cavity is formed in the multilayer substrate to mount electronic components, then component integration is achieved, but crack occurrence becomes more likely
Solution Approach 1:
Instead of forming a cavity in the substrate to mount components (which creates stress concentration points), the invention embeds chip-type electronic components directly within the resin substrate during the molding process. This inversion of the mounting approach eliminates cavity formation and the associated crack risks while achieving the same component integration goal.
3Reliability
If the first embedded chip-type electronic component is located close to the peripheral surface, then crack suppression is enhanced, but the component is more exposed to external stresses
Solution Approach 1:
The embedded chip-type electronic component positioned near the peripheral surface acts as a preemptive reinforcement element that prevents crack initiation and propagation in the resin substrate before external stresses can cause damage. By placing the component strategically in the stress-prone peripheral region, the structure is strengthened in advance to withstand future external stresses.
Data Source
AI summary
A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface.