Embedded Chiplets With Backside Power Delivery for Signal Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor devices shrink, power delivery becomes increasingly inefficient due to electrical isolation issues, high density of circuit elements, and signal interference, making it challenging to provide power effectively, especially with traditional frontside power delivery methods.
Innovation Solution
The implementation of a backside power delivery network that separates power delivery from signal routing, using hybrid bonding and insulating materials like silicon oxide or organic dielectrics to connect power and ground contacts on the backside of semiconductor substrates, reducing the need for metal layers on the frontside and minimizing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If frontside power delivery is used, then power can be delivered to circuit elements, but power losses increase and signal interference occurs due to high density of circuit elements and interconnects
Solution Approach 1:
The patent introduces backside power delivery as a new dimension for power distribution, moving power delivery from the frontside (where signals are routed) to the backside of the semiconductor substrate. This dimensional separation allows power and signals to be delivered independently without interfering with each other, reducing power losses and eliminating signal interference while maintaining compatibility with existing high-density frontside circuit elements
2Area of stationary object
If tight spacing between interconnects is used to increase density, then device area is reduced, but electrical isolation issues and signal interference increase
Solution Approach 1:
The patent segments the power delivery function from the signal routing function by delivering power through the backside and signals through the frontside. This segmentation allows tight spacing between interconnects on the frontside to be maintained for high density, while the backside power delivery network provides electrical isolation and eliminates signal interference, as power and signals traverse different physical paths
Solution Approach 2:
The patent introduces an intermediary approach by using the backside of the substrate as a separate power delivery channel. This intermediary path for power delivery mediates between the need for high-density frontside interconnects and the need for electrical isolation, allowing both to coexist without compromising either area efficiency or signal integrity
3Adaptability or versatility
If power is delivered through multiple metal layers, then power can reach distant circuit elements, but power losses increase due to traversing large numbers of metal layers
Solution Approach 1:
The patent delivers power through the backside dimension of the substrate rather than traversing multiple frontside metal layers. This dimensional change provides direct power access to circuit elements on the frontside without the resistance and power losses associated with long paths through multiple metal interconnect layers, while still achieving versatile power delivery across the entire device area
4Power
If frontside power delivery is used, then power can be delivered to active circuitry, but signal interference occurs between power and signaling interconnects
Solution Approach 1:
The patent segments power delivery and signal routing into separate spatial domains: power is delivered through the backside while signals are routed on the frontside. This segmentation eliminates electromagnetic interference between power and signal interconnects, as they occupy different physical spaces and do not share common impedance paths, while maintaining full power delivery capability to active circuitry
Solution Approach 2:
The backside power delivery network acts as an intermediary that separates power and signal paths. By introducing this intermediary power delivery channel on the backside, the patent eliminates direct interaction between power and signal interconnects on the frontside, preventing signal interference while maintaining effective power delivery to all active circuit elements
Data Source
AI summary
An assembly may include a base element comprising a base substrate having a frontside with active circuitry and a backside opposite the frontside, a first bonding layer disposed on the frontside of the base substrate and including a signal pad to convey an electrical signal to the active circuitry. The assembly may further include a first functional element comprising a first semiconductor substrate having a frontside with active circuitry and a backside opposite the frontside, a second bonding layer disposed on the frontside of the first semiconductor substrate, and a back surface of the first functional element having a first contact feature to connect to power or ground, wherein the first bonding layer is hybrid bonded to the second bonding layer.