Embedded Chips in Security Paper Manufacturing

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Solution Overview

Problem

Existing security papers with electronic chips for fraud detection are complex and costly to manufacture, and the chips are not adequately anchored to the paper, making them prone to damage.

Innovation Solution

Embedding electronic chips directly into the paper sheet during its formation from wet cellulose fibre pulp and optionally incorporating them between two sheets, ensuring firm anchoring and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chips are applied onto a support and glued or fixed onto the previously formed paper sheet, then the security paper can be manufactured with existing technology, but the application process becomes relatively complicated and costly, and the chips cannot be appropriately anchored to the paper sheet

Engineering Contradiction:
Improvechip anchoringVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The chips are introduced into the paper sheet during the paper formation process, before the paper is completely dried and set. This preliminary action allows the chips to be embedded in the wet pulp, ensuring proper anchoring without requiring separate application and gluing steps that would increase process complexity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The chip introduction step is merged with the paper formation process. Instead of applying chips to a finished paper sheet as a separate operation, the chips are introduced during the same continuous process that forms the paper, combining two operations into one and reducing overall process complexity

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If chips are applied onto a previously formed paper sheet, then the paper can be manufactured first and chips added later, but the chips remain exposed on the surface and are subject to possible damage unless coated with a protective layer

Engineering Contradiction:
Improvechip protectionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The chips are nested within the paper sheet structure itself by embedding them in the wet pulp during formation. The paper material surrounds and encases the chips, providing inherent protection without requiring additional protective coating layers that would increase process complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The chips are embedded in the wet pulp before the paper dries and sets, ensuring they become enclosed within the paper matrix. This preliminary embedding action provides protection before the paper structure is finalized, eliminating the need for subsequent protective coating steps

Inventive Principle:
Principle #10Preliminary action

3Reliability

If chips are applied onto a support and glued onto the paper sheet, then the chips can be attached to the paper, but the application process becomes relatively costly

Engineering Contradiction:
Improvechip attachmentVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The chip attachment is merged with the paper formation process itself. The chips are introduced during the same continuous operation that forms the paper, eliminating the need for separate gluing or adhesive application steps that would increase manufacturing cost

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wet pulp itself serves as the embedding medium, requiring no additional adhesives or bonding agents. The natural properties of the wet paper material provide the anchoring function, eliminating the need for separate attachment materials and reducing manufacturing cost

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a cost-effective, securely anchored, and damage-resistant security paper that allows rapid identification and high printing quality, with a simplified manufacturing process.

Implementation Method 1

forming a sheet of paper by gradually subtracting water from the pulp

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

the chips being deposited directly onto the wet pulp and at least partially embedded in the pulp

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS8691051B2Security paper material, in particular for labelling and packaging, and manufacturing method thereof
Publication Date: 2014.04.08 GRUPPO CORDENONS
  • US8691051B2 patent drawing
  • US8691051B2 patent drawing

AI summary

A manufacturing method of a security paper material, in particular for labelling and packaging, comprising the steps of forming a paper sheet from a wet cellulose fiber pulp and providing the paper sheet with electronic chips; the chips are introduced into the paper sheet being formed during the transformation step of the pulp into paper and are deposited directly onto the wet pulp and at least partially embedded in the pulp. Optionally, an auxiliary paper sheet is coupled to the paper sheet provided with the chips so that the chips are incorporated between the two sheets.