Embedded Circuit Board with Cavity for Component Integration
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Solution Overview
Problem
Circuit boards face challenges in optimizing space usage within electronic devices due to external components occupying limited space, necessitating a more efficient integration method.
Innovation Solution
A flexible printed circuit board with a cavity is used to embed components, where conductive layers and protective layers are laminated with a component, and conductive material is applied within the cavity to secure the component, allowing for a thinner and more compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If external components are used to control functions, then functional control is achieved, but available space is reduced
Solution Approach 1:
The patent merges the component and circuit board into a single integrated structure. The component is embedded within cavities formed in the circuit board layers, eliminating the need for separate external components and their mounting space, thereby achieving both functional control and space efficiency
Solution Approach 2:
The component is nested within the circuit board structure by forming cavities in alternating layers that accommodate the component. This nesting approach allows the component to be housed inside the circuit board volume rather than occupying external space, resolving the space contradiction
2Area of stationary object
If components are embedded within the circuit board, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The cavities for embedding components are formed in advance during the circuit board manufacturing process, before the components are attached. This preliminary preparation of embedding spaces simplifies the overall manufacturing by integrating the embedding structure creation into the standard layering process rather than adding a separate complex embedding step
3Reliability
If conductive material is applied within the cavity to secure the component, then component embedding is secured, but manufacturing steps increase
Solution Approach 1:
The conductive material application is merged with the existing reflow soldering process. The same reflow step that attaches the component to the circuit board also applies the conductive material within the cavity to secure the component, eliminating the need for a separate securing step and maintaining manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the secure embedding of components within the circuit board, reducing the overall thickness and improving space utilization without the need for external adhesion, enhancing circuit configuration and efficiency.
Implementation Method 1
The conductive material is heated to a reflow temperature to attach the component to the flexible printed circuit board
Implementation Method 2
The colloid, by being heated and pressed, flows and forms an adhesive layer to adhere the substrates, flexible printed circuit board, and component
Data Source
AI summary
An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.