Embedded Circuit Board With Conductive Adhesive For Heat Dissipation
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Solution Overview
Problem
The existing design of embedding a metal base in a circuit board for heat dissipation results in a thinner copper layer at the junction, which hampers the metal base's ability to carry a large current effectively due to inadequate electrical connection.
Innovation Solution
An embedded circuit board design featuring two signal transmission layers on opposite sides of the circuit board body, an adhesive layer to bond these layers, metal bases embedded and electrically connected to the signal transmission layers through conductive elements, and a magnetic core, ensuring a constant thickness of the conductive layers for enhanced current carrying capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the metal base is embedded in the circuit board for heat dissipation, then the heat dissipation performance is improved, but the copper layer at the junction becomes thinner which reduces the current-carrying capability
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary substance between the metal base and the circuit board. This conductive adhesive serves dual functions: it provides thermal conduction for heat dissipation while also maintaining adequate electrical conduction for current carrying. The conductive adhesive compensates for the reduced copper layer thickness at the junction by providing an additional conductive path, thus resolving the contradiction between heat dissipation and current-carrying capability.
2Strength
If the fixed material is located at a level higher than the metal base surface, then the bonding is achieved, but the copper layer thickness is reduced which is not conducive to large current-carrying function
Solution Approach 1:
The conductive adhesive layer performs multiple functions simultaneously: it provides mechanical bonding between the metal base and circuit board, ensures thermal conduction for heat dissipation, and maintains electrical conduction for current carrying. By making the adhesive layer conductive, the patent eliminates the need to choose between bonding strength and current-carrying capability, as the same layer fulfills all three functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the current-carrying capability of the metal base and improves heat dissipation while maintaining a consistent thickness of the signal transmission layers, addressing the issue of thin copper layers at the junction.
Implementation Method 1
an adhesive layer, arranged between the circuit board body and at least one of the signal transmission layers, and configured to bond the signal transmission layers to the circuit board body
Implementation Method 2
a first conductive element, arranged in the adhesive layer at a position corresponding to the one or more metal bases and electrically connect the signal transmission layers to the one or more metal bases
Implementation Method 3
a design of embedding a metal base into a circuit board for heat dissipation
Data Source
AI summary
Disclosed are an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a circuit board body; signal transmission layers (1200), wherein the signal transmission layers are arranged on two opposite sides of the circuit board body; bonding layers, wherein the bonding layers are arranged between at least one signal transmission layer and the circuit board body and used for bonding the signal transmission layer to the circuit board body; metal bases which are embedded in the circuit board body and are electrically connected to the signal transmission layers on two opposite sides of the circuit board body; conductive parts which are arranged at the positions in the bonding layers corresponding to the metal bases, and are electrically connected to the signal transmission layer and the metal bases; and magnetic cores embedded in the circuit board body.