Embedded Circuit Board Grooves for Adhesion and Thickness
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Solution Overview
Problem
Circuit boards are excessively thick due to limited contact area between the circuit layer and the dielectric layer, which reduces adhesion between the two, leading to inferior performance.
Innovation Solution
A method involving the formation of a circuit groove and blind hole in the copper-clad laminate, followed by copper plating and etching to create an outer circuit layer embedded in the dielectric layer, increasing contact area and adhesion while reducing thickness, and the application of a solder mask with openings to enhance electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the circuit board uses conventional dielectric layers and circuit layers, then the structure is simple, but the circuit board becomes very thick and adhesion between layers is reduced
Solution Approach 1:
The patent transitions from a conventional planar contact interface to a three-dimensional contact structure by forming grooves and blind holes in the dielectric layer. The circuit layer is configured to contact the dielectric layer at multiple levels (surface contact and embedded contact within grooves/holes), effectively adding a vertical dimension to the contact interface. This increases the contact area from a two-dimensional surface to a three-dimensional structure, thereby improving adhesion without increasing overall thickness.
Solution Approach 2:
The dielectric layer is designed with a porous-like structure containing multiple grooves and blind holes, creating a network of cavities that allow the circuit layer to penetrate and form mechanical interlocks. This porous configuration significantly increases the effective contact area between the circuit layer and dielectric layer, strengthening adhesion while maintaining a compact overall thickness.
2Reliability
If the contact area between circuit layer and dielectric layer is increased, then adhesion is improved, but the circuit board thickness increases
Solution Approach 1:
The circuit layer is nested within the dielectric layer structure by forming blind holes and grooves that receive portions of the circuit layer. The circuit layer is embedded into the dielectric layer rather than simply placed on top, creating a nested configuration where the circuit layer is partially contained within the dielectric layer's cavities. This nesting approach increases contact area while maintaining compact thickness.
Solution Approach 2:
The patent utilizes the vertical dimension within the dielectric layer thickness to create multiple contact interfaces. By forming grooves and blind holes at different depths, the circuit layer establishes contact with the dielectric layer at multiple vertical levels, transforming a single-plane contact problem into a multi-level three-dimensional contact structure that improves adhesion without proportionally increasing overall thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in improved adhesion between the circuit and dielectric layers, reduced board thickness, and enhanced electrical connectivity through increased contact areas and controlled soldering processes.
Implementation Method 1
a copper-plated layer is formed in the circuit groove and the blind hole
Data Source
AI summary
A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.