Component-Embedded Circuit Board Layout for Switching Noise Reduction
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Solution Overview
Problem
Conventional component-embedded circuit boards experience noise issues due to inductance generated by switching operations, which existing shielding technologies are unable to effectively mitigate.
Innovation Solution
The design incorporates a first and second conductive layer with an insulating layer in between, featuring semiconductor elements with exposed connection terminals and an intermediate conductor that connects these elements, with at least one conductive layer overlapping the intermediate conductor to cancel out magnetic fluxes and reduce inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional shielding technologies are applied to component-embedded circuit boards, then shielding property is improved, but noise caused by switching operation cannot be effectively reduced
Solution Approach 1:
The patent converts the harmful magnetic flux generated by switching operations into a beneficial effect by strategically arranging conductive layers to generate opposing magnetic fluxes that cancel each other out. The first and second conductive layers are positioned to create magnetic fluxes in opposite directions, transforming the noise-generating magnetic fields into a noise-canceling system.
Solution Approach 2:
The patent moves from conventional planar shielding to a three-dimensional layered structure where conductive layers are arranged at different heights and positions. By creating overlapping regions between the first conductive layer and intermediate conductor, and the second conductive layer and intermediate conductor, the patent utilizes vertical spacing and horizontal overlap to achieve magnetic flux cancellation that conventional two-dimensional shielding cannot provide.
2Productivity
If electronic components are mounted inside the printed circuit board to increase circuit density, then component integration is improved, but inductance and switching noise are generated
Solution Approach 1:
The patent merges the functions of component embedding, noise reduction, and magnetic flux cancellation into a single integrated structure. The conductive layers are not only structural elements for electrical connection but also serve as active noise-canceling components. The intermediate conductor and conductive layers work together as a unified system that simultaneously achieves high circuit density and effective noise suppression.
Solution Approach 2:
The intermediate conductor acts as a mediator between the first and second conductive layers, providing both electrical connection and magnetic flux cancellation. By positioning the intermediate conductor to overlap with both conductive layers and arranging currents to flow in opposite directions, the intermediate conductor serves as the key element that enables noise reduction while maintaining circuit functionality and density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces switching noise by canceling out magnetic fluxes, eliminating the need for additional noise reduction components like snubber circuits and improving the overall reliability of the circuit board.
Implementation Method 1
at least one of the first conductive layer or the second conductive layer is configured to have a portion that overlaps the intermediate conductor when viewed from a laminating direction of the first conductive layer and the second conductive layer
Data Source
AI summary
A component-embedded circuit board includes: a first conductive layer in which a high potential side power supply terminal is provided; a second conductive layer in which a low potential side power supply terminal is provided; an insulating layer formed between the first conductive layer and the second conductive layer; a first semiconductor element and a second semiconductor element that are embedded in the insulating layer and that each include a high potential side connection terminal and a low potential side connection terminal exposed from the insulating layer; and an intermediate conductor that connects the low potential side connection terminal of the first semiconductor element and the high potential side connection terminal of the second semiconductor element. The first semiconductor element and the second semiconductor element, which are arranged apart in an in-plane direction of the insulating layer, and the intermediate conductor are provided between the first conductive layer and the second conductive layer. The high potential side power supply terminal and the high potential side connection terminal of the first semiconductor element exposed from the insulating layer are connected by the first conductive layer. The low potential side power supply terminal and the low potential side connection terminal of the second semiconductor element exposed from the insulating layer are connected by the second conductive layer. At least one of the first conductive layer or the second conductive layer is configured to have a portion that overlaps the intermediate conductor when viewed from a laminating direction of the first conductive layer and the second conductive layer.