Embedded Circuit Board Through Opening Bubble Prevention
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Solution Overview
Problem
Current embedded circuit board manufacturing processes often result in air bubble formation due to residual gas being trapped between components and pads, which negatively affects the quality of the board.
Innovation Solution
A through opening structure is pre-set in the embedded circuit board design, allowing colloid to enclose the embedded element from all directions, preventing gas from being trapped and improving bonding strength by using insulating elements to fill gaps and support the embedded component, thus reducing bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If colloid material is used to fill gaps around embedded elements, then bonding strength is improved, but air bubbles are trapped and quality deteriorates
Solution Approach 1:
The patent creates through openings in the pads before embedding the elements. This preliminary action allows gas to escape during the subsequent colloid filling process, preventing bubble formation while maintaining bonding strength. The through openings are formed by etching or drilling through the pad structures, creating escape paths for trapped gas.
Solution Approach 2:
The patent converts the harmful trapped gas into a beneficial escaping flow by providing through openings. The gas that would normally cause defects is now channeled out through the openings, transforming the problem of gas trapping into a controlled escape mechanism that ensures complete colloid filling without bubbles.
2Stability of the object's composition
If element and pads act as blockages to colloid flow, then structural integrity is maintained, but gas cannot escape and bubbles form
Solution Approach 1:
The patent segments the pad structure by creating through openings that divide the solid pad into regions with escape paths. This segmentation maintains the overall structural integrity of the pad while creating channels for gas escape, allowing the colloid to flow around the embedded element without trapping air bubbles.
Solution Approach 2:
The through openings act as intermediaries between the trapped gas and the external environment. These openings provide a mediator path that allows gas to escape from the region between the embedded element and the pad, resolving the conflict between maintaining structural integrity and enabling gas escape.
3Ease of manufacture
If prepreg glue content is increased to improve colloid fluidity, then filling capability is enhanced, but bubble formation becomes harder to avoid
Solution Approach 1:
The patent extracts the gas from the system by providing through openings that lead to the external environment. Instead of relying solely on increasing colloid fluidity to push gas out, the gas is actively removed through the openings, making the process less dependent on high glue content and reducing bubble formation risks.
Solution Approach 2:
The patent uses hydraulic principles by allowing the colloid to flow under pressure through the embedding process, with the through openings providing pressure relief paths for the trapped gas. This hydraulic flow mechanism, combined with the pneumatic escape paths, enables complete filling without requiring excessive glue content.
Data Source
AI summary
An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.