Embedded Circuit Elements in Semiconductor Package Assemblies
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Solution Overview
Problem
Conventional package-on-package (PoP) structures face limitations in reducing device footprint and achieving flexible interconnect configurations, particularly in accommodating different solder ball pitches and impedance requirements, which restricts the stacking of multiple electronic devices with varying pitches and impedance needs.
Innovation Solution
The method involves forming a substrate with embedded vias and a mold compound that encapsulates circuit elements, allowing for customizable top-side package interconnects and routing layers on the top surface of the mold compound, enabling flexible placement of external pads and interconnects between stacked dies, and using through-silicon vias for increased I/O interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional package-on-package structures are used, then device footprint is reduced, but flexibility in accommodating different solder ball pitches and impedance requirements is limited
Solution Approach 1:
The patent divides the package structure into separate functional layers: a substrate with embedded passive components, a mold compound layer, and a top-side interconnect layer. This segmentation allows independent optimization of each layer for different pitch and impedance requirements while maintaining a compact footprint.
Solution Approach 2:
The patent transitions from planar interconnects to three-dimensional routing by embedding passive components within the substrate and mold compound, and routing signals through vertical vias and top-side pads. This dimensional change enables flexible accommodation of different solder ball pitches without increasing footprint.
2Adaptability or versatility
If multiple electronic devices with varying pitches are stacked, then device functionality is enhanced, but interconnect configuration flexibility is restricted
Solution Approach 1:
The substrate structure serves multiple functions: it provides mechanical support, embeds passive components for impedance control, creates vertical interconnects via vias, and supports top-side pads for flexible solder ball arrangement. This multi-functionality enables stacking of devices with varying pitches without increasing overall system complexity.
Solution Approach 2:
The mold compound acts as an intermediary material that encapsulates the substrate and provides a platform for forming top-side interconnects. It mediates between the embedded passive components and the external solder balls, enabling flexible pitch accommodation while simplifying the interconnect configuration process.
3Adaptability or versatility
If interposers are used to enable flexible interconnects, then pitch accommodation is improved, but device footprint and complexity increase
Solution Approach 1:
The patent merges the functions of the substrate, passive components, and interconnect structure into a single integrated package assembly. The substrate itself becomes the interconnect platform with embedded passives, eliminating the need for separate interposers and reducing both footprint and complexity.
Solution Approach 2:
The patent extracts the passive components from traditional surface-mount positions and embeds them within the substrate and mold compound. This extraction allows the passive components to serve dual purposes: as functional elements and as part of the interconnect structure, eliminating the need for additional interposer structures.
Data Source
AI summary
Methods of forming stacked die assemblies are described. Those methods/structures may include forming a circuit element on a first substrate, wherein a first die is adjacent the circuit element, forming a via disposed directly on a surface of the circuit element, and forming a mold compound on the first die, on the circuit element and on the via, wherein the via and circuit element are completely embedded within the mold compound. A routing layer is formed on a top surface of the mold compound, and a second die is coupled with the routing layer.