Embedded Circuit Pattern Thickening for Reliable Interlayer Connections
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Solution Overview
Problem
The connection reliability between circuit patterns and wiring conductors in electronic components is compromised due to stress concentration at interlayer connection portions, especially when temperature changes, and the formation of thick interlayer connections can lead to recesses and reduced reliability.
Innovation Solution
The electronic component design includes an insulating layer with a circuit pattern and a wiring conductor, where the thickness of the circuit connection portion is greater than the average thickness of other portions, and a manufacturing method involving electrolytic plating with high current density and reverse tapered insulating walls to form thicker circuit patterns and reduce interlayer connection thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the interlayer connection portion is made thick to ensure connection strength, then the connection reliability is improved, but stress concentration increases and recess formation occurs reducing reliability
Solution Approach 1:
The circuit pattern is designed with non-uniform thickness, where the thickness at the interlayer connection portion is specifically increased compared to other portions. This local thickening provides enhanced mechanical strength and stress distribution at the critical connection point without increasing the thickness of the entire circuit pattern, thereby preventing recess formation while maintaining connection reliability.
Solution Approach 2:
The circuit pattern is pre-formed with a thicker section at the interlayer connection portion before the interlayer connection is established. This preliminary thickening prepares the structure to withstand subsequent thermal stress and mechanical loads, preventing stress concentration and connection failure during operation.
2Ease of manufacture
If the distance between circuit patterns in adjacent wiring layers is increased, then manufacturing complexity is reduced, but the interlayer connection portion becomes thicker increasing stress
Solution Approach 1:
Instead of uniformly increasing the distance between circuit patterns, the invention applies local thickening only at the interlayer connection portion of the circuit pattern. This allows maintaining small distances between adjacent wiring layers for manufacturing simplicity while providing the necessary stress distribution through localized thickness enhancement at the connection point.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces stress on interlayer connections and improves the connection reliability between circuit patterns and wiring conductors by forming thicker circuit connection portions, enhancing the component's performance under temperature variations.
Implementation Method 1
a step of forming a circuit pattern by plating and growing a metal between the insulating walls by electrolytic plating
Data Source
AI summary
In an electronic component including a circuit pattern embedded in an insulating layer, connection reliability between the circuit pattern and a wiring conductor outside the insulating layer is improved. An electronic component includes an insulating layer; a circuit pattern embedded in the insulating layer; a wiring conductor formed outside the insulating layer; and an interlayer connection portion that connects a circuit connection portion, which is a part of the circuit pattern, and the wiring conductor with an opening of the insulating layer interposed therebetween. In the circuit pattern, a thickness of a portion immediately below the interlayer connection portion of the circuit connection portion is larger than an average thickness of a portion other than the circuit connection portion.