Embedded Circuitry in Injection-Molded Plastic Structures
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Solution Overview
Problem
Electronic devices and external cases formed from plastic often face issues of bulkiness due to excessive space consumption by circuitry and inadequate moisture resistance.
Innovation Solution
Embedding circuitry such as electrical components, wires, and near-field communications antennas within injection-molded plastic structures, where portions can protrude or be covered by plastic, using flexible printed circuits and thermoset adhesives to minimize space and enhance moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuitry is placed outside the plastic housing, then moisture resistance is improved, but device volume increases
Solution Approach 1:
The patent embeds circuit boards, antennas, and electronic components directly within the injection-molded plastic housing structure. The housing acts as both structural enclosure and protective container, with components nested inside cavities or recesses formed during the molding process, eliminating the need for external mounting while maintaining moisture resistance.
Solution Approach 2:
The patent combines the housing structure with circuit board support functions by integrating mounting features, antenna elements, and component housings directly into the plastic mold. This merging of structural and functional elements reduces overall device volume while maintaining protection against moisture.
2Volume of moving object
If circuitry is embedded within the plastic housing, then device volume is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates circuit boards, antennas, and components into the housing during the injection molding process itself. Support features, mounting structures, and component positioning elements are pre-formed as integral parts of the mold, allowing components to be embedded without requiring complex post-assembly operations.
Solution Approach 2:
The plastic housing performs multiple functions simultaneously: structural support, moisture protection, component mounting, and antenna integration. This multi-functionality reduces the need for separate manufacturing processes and assembly steps, thereby reducing overall manufacturing complexity despite the embedded components.
3Reliability
If more plastic is used to cover components, then moisture resistance is improved, but material usage increases
Solution Approach 1:
Components are nested within cavities and recesses of the housing structure, allowing the plastic material to conform tightly around components. This nesting approach provides moisture protection through minimal wall thicknesses while avoiding excess material usage, as the plastic is precisely molded to enclose only the necessary portions of embedded components.
Data Source
AI summary
Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.