Embedded Electrical Circuitry on Filled Organic Polymer Surfaces
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Solution Overview
Problem
Mechanical installation of electrical components and circuitry on hard surface materials is time-consuming and expensive, requiring on-site fabrication of channels or openings, which complicates the process.
Innovation Solution
A method involving the production of an electrical circuit on a support, application of a polymerizable composition containing an organic polymer precursor and filler, and polymerization to create a solid polymer layer with the circuit adhered and embedded, followed by optional removal of the support to expose the circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical installation methods are used to install electrical circuitry in hard surface materials, then electrical components can be mounted and circuitry can be installed, but the process becomes time-consuming and expensive requiring post-fabrication modifications
Solution Approach 1:
The patent applies preliminary action by embedding electrical circuitry and components into the hard surface material during the manufacturing process itself, rather than installing them afterward. The circuit board is placed in a recess formed in the material, and the material is then molded around it to encapsulate the electronics, completing the installation before the product is delivered to the customer.
Solution Approach 2:
The patent segments the hard surface material into distinct regions: a recess area that accommodates the electrical circuit board and components, and the surrounding structural material. This segmentation allows the electrical components to be integrated into the material without compromising the structural integrity or aesthetic appearance of the overall product.
2Reliability
If mechanical installation methods are used to install electrical circuitry in hard surface materials, then electrical components can be mounted, but the process becomes expensive requiring post-fabrication modifications
Solution Approach 1:
The patent merges the electrical circuitry installation process with the hard surface material manufacturing process. By forming the recess and encapsulating the circuit board during the same molding operation that creates the hard surface material, the patent eliminates separate post-fabrication steps, reducing labor costs and manufacturing complexity.
Solution Approach 2:
The hard surface material serves multiple functions: it provides the structural surface material, creates the recess for housing electrical components, and acts as the encapsulating material that protects and integrates the electronics. This multi-functionality reduces the need for additional materials and processing steps.
3Reliability
If electrical circuitry is embedded into polymeric material, then protection and integration are achieved, but mechanical access methods such as sanding, grinding, drilling are needed to access conductors
Solution Approach 1:
The patent applies local quality by providing different levels of encapsulation: the electrical circuit board and components are embedded within the hard surface material for protection, but specific areas are left accessible or removable to allow access to conductors when needed. This localized approach maintains protection where required while enabling access where necessary.
4Adaptability or versatility
If post-fabrication modifications are performed to accommodate electrical parts, then electrical components can be installed, but the process becomes time-consuming and expensive
Solution Approach 1:
The patent performs the accommodation of electrical components during the initial manufacturing process. The recess is formed and the circuit board is positioned before the final product is completed, eliminating the need for time-consuming post-fabrication modifications and significantly improving installation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient and cost-effective integration of electrical circuitry into polymeric materials, providing protection and simplifying installation by embedding the circuit within the polymer layer, reducing time and labor costs.
Implementation Method 1
polymerizing the at least one organic polymer precursor while the polymerizable composition is in contact with support and the electrical circuit to produce a solid polymer layer that includes an organic polymer produced in the polymerization of the at least one organic polymer precursor
Data Source
AI summary
Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.