Printing Support With Embedded Circuitry for In-Process Electronics Monitoring
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Solution Overview
Problem
Conventional additive manufacturing of electronic devices lacks real-time monitoring and control of electrical characteristics during the build-up phase, leading to potential deviations from target specifications due to production tolerances.
Innovation Solution
Incorporating an electric circuitry with supply terminals into a dielectric encapsulation within a printing support, allowing for continuous measurement and adjustment of electrical characteristics during the additive manufacturing process by applying electric signals to device terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a polymer layer is used as the printing support interface, then the thermal load transfer for curing or self-welding is enabled, but the electrical characteristics cannot be monitored during the build-up phase
Solution Approach 1:
The printing support is designed to serve multiple functions simultaneously: it provides thermal load transfer for curing processes, electrical conductivity for monitoring electrical characteristics, and mechanical support for the build-up phase. By integrating conductive elements into the printing support, the device can monitor electrical properties like resistance or conductivity during manufacturing without requiring separate monitoring systems.
Solution Approach 2:
The printing support acts as an intermediary between the manufacturing process and quality control. It transfers not only thermal energy but also enables electrical signal transmission to monitor the electrical characteristics of the device being manufactured. This intermediary structure allows real-time detection of electrical properties without disrupting the manufacturing process.
2Manufacturing precision
If additive manufacturing is carried out within particular tolerances, then the manufacturing process is controllable, but the manufactured device may have electric characteristics outside target specification
Solution Approach 1:
The system implements feedback by continuously monitoring electrical characteristics during the additive manufacturing process. Electrical signals are applied to the device under test, and the response (such as resistance or conductivity changes) is measured and fed back to the control system. This feedback loop allows real-time adjustment of manufacturing parameters to ensure the final electrical characteristics meet target specifications, preventing defects before they occur.
Solution Approach 2:
Electrical monitoring is performed preliminarily during the manufacturing process itself, rather than after completion. By measuring electrical characteristics in real-time as the device is being built, the system can detect and correct deviations from target specifications before the manufacturing process ends, ensuring reliability without requiring post-production testing.
3Reliability
If real-time electrical monitoring is implemented during additive printing, then the electrical characteristics can be controlled, but the device complexity increases
Solution Approach 1:
The monitoring function is merged with the printing support structure itself. Conductive elements are integrated into the support, allowing it to simultaneously provide mechanical support, thermal transfer, and electrical monitoring capabilities. This consolidation reduces overall system complexity by combining multiple functions into a single component rather than adding separate monitoring systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring and adjustment of electrical properties, ensuring the manufactured electronic device meets target specifications without the need for post-printing measurements, particularly beneficial for personalized items and cyber security applications.
Implementation Method 1
This polymer layer is electrically non-conductive and transfers only a thermal load from the print table to the AME-device to support the curing or the self-welding process inside the AME-device
Implementation Method 2
applying electric signals from the at least one supply terminal to the at least on device terminal to measure an electric characteristic of the conductive structure during the process of additive printing of the electronic device
Data Source
AI summary
A system for additive manufacturing of an electronic device includes providing a printing support with an electric circuitry embedded in a dielectric encapsulation and at least one supply terminal connected to the electric circuitry. The method further includes an additive printing the electronic device on the printing support by forming a conductive structure embedded in a dielectric base material and at least one device terminal exposed on a surface of the electronic device, wherein the at least one supply terminal of the printing support is arranged to electrically contact the at least one device terminal. The method further includes applying electric signals from the at least one supply terminal to the at least on device terminal to measure an electric characteristic of the conductive structure during the process of additive printing of the electronic device.