Embedded Circuits in Ultrasound Transducer Backing Blocks
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Solution Overview
Problem
The existing methods for manufacturing ultrasound transducer arrays face challenges with conductor density and interconnection complexity, leading to increased parasitics, shorting risks, and high manufacturing costs, particularly in two-dimensional arrays and due to the high number of cables required.
Innovation Solution
The integration of semiconductor fabrication and embedded circuits within the acoustic backing material, using planar sheets with embedded chips and conductors formed through photolithography, reduces the number of connections and enhances conductor density, allowing for cheaper and denser interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If z-axis conductors are used in the backing material, then conductor density is improved, but alignment and holding of conductors during formation becomes difficult
Solution Approach 1:
The patent merges the conductor formation process with the backing material formation process by using the same mold cavity for both. The mold includes conductor formation cavities that receive conductive material, and when the backing material is formed, the conductors are simultaneously created in precise alignment within the backing, eliminating separate alignment steps.
Solution Approach 2:
The patent performs preliminary action by pre-forming the conductor patterns within the mold cavities before the backing material is poured in. The conductive material is placed in the mold cavities in advance, and the backing material is then formed around them, ensuring proper positioning and holding without requiring post-formation alignment operations.
2Device complexity
If circuits are positioned in the probe housing to reduce cable count, then the number of cables is reduced, but interconnection of electrodes to circuitry becomes difficult
Solution Approach 1:
The patent merges the circuit integration with the backing material formation by embedding circuits directly into the backing during the same manufacturing process. The circuits are formed in circuit cavities within the backing material, creating direct integration between the transducer elements and the circuitry without requiring complex external interconnection steps.
3Adaptability or versatility
If thousands of interconnections are made within circuits and between elements, then element connectivity is achieved, but parasitics increase and manufacturing cost increases
Solution Approach 1:
The patent transitions from planar two-dimensional interconnections to three-dimensional embedded interconnections by placing circuits and conductors within the thickness dimension of the backing material. This vertical integration reduces the horizontal spread of interconnections and allows for more compact routing paths between elements and circuits.
Data Source
AI summary
One or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing.