Embedded-Clock Digital Sensor Circuit for Dense IC Thermal Monitoring
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Solution Overview
Problem
The increased density of transistors on integrated circuits (ICs) leads to thermal and power management challenges, as existing sensor systems require separate power supplies and clock signals, limiting their placement and accuracy due to the need for routing additional signal paths and voltage connections.
Innovation Solution
Implementing a sensor circuit with local clock and supply voltage, utilizing two ring oscillators with different characteristics to sense voltage and temperature, and using a local clock circuit within each sensor to eliminate the need for external clock signal distribution and shared power supplies, allowing for more flexible placement and reduced susceptibility to tampering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are distributed throughout the IC to improve measurement precision, then temperature and voltage sensing accuracy is improved, but device complexity increases due to the need for separate power supplies and clock signal distribution to each sensor
Solution Approach 1:
The patent combines the clock circuit and power supply functions directly into each sensor unit. Each sensor now has its own embedded clock circuit that generates clock signals locally, eliminating the need for external clock distribution. The sensor also operates from the local supply voltage of its functional circuit block, merging power supply functions. This integration resolves the contradiction by reducing device complexity while maintaining distributed sensing capability for improved measurement precision.
Solution Approach 2:
Each sensor unit is made self-sufficient by embedding its own clock circuit and operating from local power supplies. The sensor serves itself by generating its own clock signals and drawing power from the local supply voltage, eliminating dependencies on external clock distribution networks and separate power supplies. This self-service approach reduces overall system complexity while enabling widespread sensor distribution for accurate temperature and voltage monitoring.
2Quantity of substance
If sensor density is increased to improve thermal management, then more sensors can be placed on the IC, but the need for external clock signal distribution and separate power supplies limits placement flexibility
Solution Approach 1:
By merging the clock circuit and power supply functions into each sensor unit, the patent enables sensors to be placed wherever needed on the IC without being constrained by clock signal routing or separate power supply connections. Each sensor uses the local supply voltage of its host functional circuit block and generates its own clock signals, providing maximum placement flexibility for optimized thermal management and monitoring coverage.
Solution Approach 2:
Each sensor is made self-sufficient with embedded clock circuits and local power supply operation, allowing sensors to be independently placed throughout the IC based on thermal management needs rather than being constrained by external signal distribution infrastructure. This self-service capability enables high sensor density with optimal placement flexibility for effective thermal monitoring.
3Reliability
If separate power supplies are used for sensors to ensure reliable operation, then sensor reliability is improved, but power consumption increases and layout is more complex
Solution Approach 1:
The patent merges the power supply function into the sensor's operational architecture by having each sensor operate from the local supply voltage of its functional circuit block. This eliminates the need for separate dedicated power supplies for each sensor, reducing overall power consumption while maintaining reliable operation through the use of stable local power domains already present in the IC architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more accurate and versatile temperature and voltage sensing with reduced power consumption and increased sensor density on ICs, improving thermal management and performance balancing while simplifying the layout and reducing tampering risks.
Implementation Method 1
first and second ring oscillators that produce output signals having frequencies that vary based on voltage and temperature
Implementation Method 2
a local clock circuit within each sensor that eliminates the need to route a clock signal to each of the sensors
Data Source
AI summary
A sensor circuit and integrated circuit having the same is disclosed. In one embodiment, a sensor circuit includes first and second ring oscillators having different circuit topologies. A first counter is coupled to receive an output signal from the first ring oscillator, while a second counter is coupled to receive an output signal from the second ring oscillator. The sensor circuit further includes a local clock circuit that provides a clock signal to the first and second counters. Furthermore, the local clock circuit is coupled to provide the clock signal exclusively to circuitry within the sensor circuit, the circuitry including the first and second counters.