Embedded Multi-Layered Coil Diaphragm for Miniaturized MEMS Speakers
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Solution Overview
Problem
Current MEMS techniques lack a method for manufacturing moving-coil speakers that can effectively scale down electronic products to smaller sizes while maintaining performance.
Innovation Solution
A movable embedded microstructure comprising a substrate, diaphragm, circuit board, permanent magnetic element, and multi-layered coil, where the multi-layered coil is embedded in the diaphragm with a seed layer and soft magnetic element, and a dielectric layer connects the coil layers to enhance flexibility and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional MEMS techniques are used to manufacture moving-coil speakers, then the size of electronic products can be scaled down, but the manufacturing capability and performance do not meet requirements
Solution Approach 1:
The coil structure is embedded within the diaphragm layer structure, with the coil winding nested inside the diaphragm thickness. This allows the speaker components to be integrated in a compact, nested arrangement that achieves miniaturization while maintaining manufacturing feasibility through standard semiconductor-like fabrication processes
Solution Approach 2:
The coil is arranged in a multi-layered three-dimensional structure rather than a planar configuration. By utilizing vertical stacking and multiple layers within the diaphragm, the design achieves compact volume while providing sufficient coil area for performance, transitioning from two-dimensional to three-dimensional space utilization
2Volume of moving object
If the coil is embedded in the diaphragm, then the overall size is reduced, but the coil structure becomes more complex
Solution Approach 1:
The coil structure is divided into multiple segments or layers, with each layer forming a portion of the complete coil winding. This segmentation allows the complex coil to be fabricated using repeated, standardized fabrication steps, reducing the complexity of the overall manufacturing process while achieving the required three-dimensional coil configuration
Solution Approach 2:
The coil structure is pre-formed and embedded within the diaphragm during the fabrication process, rather than being assembled separately. This preliminary action integrates the coil formation into the diaphragm manufacturing sequence, reducing the number of discrete steps and simplifying the overall device assembly
3Reliability
If a multi-layered coil is used, then the frequency response is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The multi-layered coil structure merges multiple coil windings into a single integrated component embedded within the diaphragm. This consolidation maintains the frequency response benefits of multi-layer coils while reducing the number of separate manufacturing operations, thereby lowering the cumulative precision requirements compared to assembling multiple separate coil components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for the miniaturization of electronic products while reducing total harmonic distortion and improving the frequency response and flexibility of the diaphragm, leading to enhanced performance and longer lifespan of the microstructure.
Implementation Method 1
a multi-layered coil is embedded in the diaphragm
Implementation Method 2
The permanent magnetic element is disposed on the circuit board and in the hollow chamber
Data Source
AI summary
A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.