Embedded Coil Component via Groove Seed Layer Alignment
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Solution Overview
Problem
The challenge lies in forming a coil component with a high aspect ratio and uniformity, where alignment mismatch between plated and seed layers occurs, limiting the formation of efficient and miniaturized power inductors.
Innovation Solution
A coil component design featuring a support member with through and via holes, where the first coil is embedded within the support member, and the second coil is connected through a via filling the via hole, with groove portions on one side filled with a conductive layer, and both coils are sealed with a magnetic material, enhancing alignment and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If anisotropic plating is used to form a coil pattern with high aspect ratio, then the coil uniformity and aspect ratio are improved, but alignment mismatch occurs between plated layer and seed layer
Solution Approach 1:
The groove portions are formed on the support member surface before the plating process, and the seed layer is deposited to fill these grooves. This preliminary structuring ensures that the seed layer and subsequent plated layer are pre-aligned with the groove geometry, preventing alignment mismatch during anisotropic plating while maintaining high aspect ratio and uniformity
2Volume of moving object
If the coil component is miniaturized and thinned to meet device requirements, then the device size is reduced, but the alignment precision of coil patterns becomes more difficult to maintain
Solution Approach 1:
The support member features localized groove portions at specific coil pattern locations, providing enhanced alignment references only where needed. This local structuring maintains alignment precision in critical areas while allowing the overall component to be miniaturized, as the grooves are integrated into the support member rather than adding external alignment fixtures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the alignment of coil patterns, reduces the overall thickness of the coil component, increases magnetic flux density, and enhances DC-bias effects by embedding the first coil within the support member, allowing for more precise control over the coil pattern and preventing short circuits.
Implementation Method 1
a magnetic material sealing the support member and the coil... increases magnetic flux density
Implementation Method 2
when a coil pattern having a high aspect ratio is formed through anisotropic plating
Data Source
AI summary
A coil component includes a body including a support member having a through hole and a via hole, first and second coils disposed on first and second sides of the support member opposing each other and having coil patterns, and a magnetic material sealing the support member and the coil, and an external electrode disposed on an exterior surface of the body. The first coil includes at least a portion embedded in the support member, and a second coil is connected to the first coil through a via filling an interior of the via hole. Groove portions, recessed toward a center of the support member according to a shape of the first coil, are filled with a first conductive layer as a lowermost layer of the first coil. The second side of the support member is in contact with a lower surface of the second coil.