Embedded Coil Assembly Using Semiconductor Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of small toroidal coil assemblies, such as embedded inductors and transformers, is time-consuming and expensive due to labor-intensive methods like hand wrapping and drilling of tiny vias in printed circuit boards.
Innovation Solution
The development of novel embedded coil assemblies and manufacturing methods that utilize semiconductor technology, including patterned metal layers, bond wires, and encapsulation with mold compound, to efficiently produce toroidal coil assemblies by dividing metal layers into circumferential sections and forming conductive structures around ferrite rings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If hand wrapping and drilling of tiny vias are used to produce small toroidal coil assemblies, then the assemblies can be embedded in printed circuit boards and molded block components, but the production process becomes time-consuming and expensive
Solution Approach 1:
The patent divides the continuous metal layer into multiple separate circumferential sections, allowing each section to be independently formed and positioned around the ferrite ring. This segmentation enables automated assembly processes while maintaining precise embedding positions, resolving the contradiction between manufacturing precision and production speed.
Solution Approach 2:
The metal layers are patterned and prepared in advance before the ferrite ring is positioned. The conductive structures are pre-formed on the substrate, allowing the ferrite ring to be simply placed into position rather than requiring post-assembly drilling and wiring. This preliminary preparation dramatically reduces production time while ensuring precise embedding.
2Reliability
If hand wrapping methods are used to create toroidal coil assemblies, then the assemblies can be produced with proper wire insulation and turns, but the labor-intensive process increases production costs and time
Solution Approach 1:
The patent replaces the mechanical hand-wrapping process with automated semiconductor manufacturing techniques. Patterned metal layers and bond wires are used instead of manually wrapped insulated wire, eliminating labor-intensive operations while maintaining reliable electrical connections through controlled deposition and bonding processes.
Solution Approach 2:
The invention changes the physical state and form of the conductive material from insulated wire to patterned metal traces and bond wires. This parameter change allows automated fabrication processes to create the coil structures, significantly reducing manufacturing complexity while maintaining electrical reliability through precise control of metal deposition and bonding parameters.
Data Source
AI summary
An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.