Embedded Communication Cavity for Signal Isolation
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Solution Overview
Problem
High-speed data transmission between processors in server and client computer applications faces challenges due to interconnect issues such as increased loss and interference from metal surface roughness, cross-talk, and spurious noise, particularly in high-frequency operations, where existing interconnects fail to maintain signal quality.
Innovation Solution
The integration of a communication cavity within a substrate, shielded with conductive material, which includes a high density interconnect structure and antennas for wireless communication, creating a controlled environment to reduce noise interference and enhance signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional interconnect structures are used for high-speed data transmission, then routing connections are established, but signal loss and interference increase due to metal surface roughness and cross-talk
Solution Approach 1:
The patent divides the interconnect structure into multiple segments: a first interconnect structure for digital signals and a second interconnect structure for RF signals. This segmentation separates different signal types to prevent cross-talk and reduce interference, directly addressing the signal quality and loss issues in traditional unified interconnect structures.
Solution Approach 2:
The patent extracts the RF signaling capability from the traditional digital interconnect structure and implements it as a separate second interconnect structure with dedicated RF antennas and routing. This extraction allows RF signals to be transmitted through optimized paths with reduced interference from digital signals, improving both signal quality and reducing energy loss.
2Productivity
If high density routing is implemented to increase connection capacity, then more signals can be transmitted, but interference and cross-talk increase
Solution Approach 1:
The patent segments the high-density routing into distinct digital and RF interconnect structures. The first interconnect structure handles digital signals with high density routing, while the second interconnect structure handles RF signals separately. This segmentation maintains high transmission capacity while preventing interference between different signal types through physical and electrical isolation.
Solution Approach 2:
The patent introduces an intermediary approach by creating separate dedicated pathways for different signal types. The second interconnect structure acts as an intermediary RF-specific channel that mediates between the digital interconnect structure and external RF communication, preventing direct interference while maintaining high data transmission capacity through optimized RF routing.
3Speed
If metal interconnects are used for signal transmission, then electrical connections are established, but noise and spurious signals increase at high frequencies
Solution Approach 1:
The patent extracts RF signal transmission from the traditional metal interconnect structure and implements it through a dedicated second interconnect structure with RF-optimized characteristics. This extraction reduces noise and spurious signals by eliminating the interference that occurs when RF and digital signals share the same metal interconnect pathways, while maintaining high-speed transmission capability.
Solution Approach 2:
The patent substitutes traditional unified metal interconnect mechanics with a dual-structure system that replaces the single-pathway approach with separate specialized pathways. The second interconnect structure uses RF-optimized design elements that reduce noise generation and spurious signals, replacing the inadequate single interconnect model with a more sophisticated dual-structure approach suitable for high-frequency operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-frequency wireless transmission and high-speed digital interconnects by isolating RF signals from digital signals, reducing noise interference and maintaining signal quality, thus improving overall communication efficiency.
Implementation Method 1
The communication cavity can include a radio frequency shield
Implementation Method 2
a first antenna and a second antenna that are exposed in the communication cavity
Data Source
AI summary
Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.