Embedded Component Carrier Cavities for mm-Wave Shielding
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Solution Overview
Problem
Designing electronic devices for the mm-wave range (30 GHz to 300 GHz) is challenging due to the need for filters with low insertion loss and high Q-factor, while also requiring small form factors and improved performance at lower costs.
Innovation Solution
An electronic device with a planar electronic component embedded in a component carrier featuring cut-out portions with electrically conductive surfaces, forming cavities on opposite sides for efficient electromagnetic shielding and wave propagation, utilizing a compact design without additional materials or processes beyond circuit board technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional filtering structures are used for mm-wave operation, then insertion loss and Q-factor performance can be achieved, but the device size becomes large and form factor requirements are not met
Solution Approach 1:
The component carrier is divided into multiple parts (first component carrier part and second component carrier part) with cut-out portions that face each other, creating cavities that provide filtering functionality. This segmentation allows the creation of compact resonant structures that achieve high Q-factor performance while minimizing overall device volume.
Solution Approach 2:
The electronic component is embedded within cavities formed by the nested arrangement of the first and second component carrier parts. The cut-out portions create nested cavities that contain the electronic component, providing both mechanical support and electromagnetic filtering in a compact integrated structure.
2Object-affected harmful factors
If external metallic housing is used for electromagnetic shielding, then shielding effectiveness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The electromagnetic shielding function is merged with the component carrier structure itself. The first and second component carrier parts with their cut-out portions and electrically conductive materials provide both mechanical support and electromagnetic shielding, eliminating the need for separate external metallic housing and simplifying the manufacturing process.
Solution Approach 2:
The component carrier serves multiple functions simultaneously: it provides mechanical support for the electronic component, creates cavities for electromagnetic filtering, and provides electromagnetic shielding through its conductive structures. This multi-functionality reduces device complexity and eliminates the need for additional dedicated shielding components.
3Reliability
If complex manufacturing processes are used to achieve high-frequency performance, then device performance is improved, but manufacturing cost increases
Solution Approach 1:
The invention achieves high-frequency performance by optimizing geometric parameters of the cavities and conductive structures rather than using complex materials or processes. The dimensions, shapes, and positions of the cut-out portions are carefully designed to create resonant structures that provide filtering and shielding at mm-wave frequencies using standard manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact electronic device with excellent high-frequency performance, efficient electromagnetic shielding, and cost-effective manufacturing, maintaining a small size without the need for external metallic housing, thus addressing the challenges of mm-wave device design.
Implementation Method 1
The cavities are delimited by surfaces (cut-out portions) within the component carrier which comprise an electrically conductive material, such as copper or another conductive metal. The cavities allow electromagnetic waves to propagate in the vicinity of the electronic component while the electrically conductive material provided on the cavity surfaces provides efficient electromagnetic shielding.
Implementation Method 2
The cavities allow electromagnetic waves to propagate in the vicinity of the electronic component while the electrically conductive material provided on the cavity surfaces provides efficient electromagnetic shielding.
Data Source
AI summary
An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.