Embedded Component Circuit Board Manufacturing Intermediate Product
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Solution Overview
Problem
The existing method for manufacturing circuit boards with embedded components, as described in publication WO 2004/089048, is not easily adaptable to traditional manufacturing processes, requiring significant investments in new manufacturing lines or alterations, making its introduction to mass production challenging.
Innovation Solution
The method involves creating an intermediate product with components embedded in an insulator layer, where contact elements protrude or are near the surface, allowing for the integration of conductor patterns and additional insulator layers in a conventional circuit-board manufacturing line, enabling easier adaptation to existing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the method from publication WO 2004/089048 is used to manufacture circuit boards with embedded components, then excellent electrical contacts and mechanically durable electronic modules are achieved, but significant investments in new or altered manufacturing lines are required
Solution Approach 1:
The manufacturing process is divided into two independent segments: first, components are embedded in insulator layers to form intermediate products using traditional techniques; second, conductor patterns are formed on these intermediates in a subsequent stage. This segmentation allows each stage to use appropriate, existing technology rather than requiring a completely new integrated process.
Solution Approach 2:
Components are embedded in insulator layers and positioned in advance to create intermediate products before conductor patterns are formed. This preliminary action allows traditional manufacturing equipment to be used for component placement, and the intermediates can then be processed by conventional conductor formation techniques without requiring simultaneous coordination of multiple new processes.
2Adaptability or versatility
If components are embedded in insulator layers with contact elements protruding or near the surface, then integration with traditional manufacturing processes is enabled, but additional process steps are required compared to conventional methods
Solution Approach 1:
The intermediate product serves multiple functions: it provides mechanical support for components, establishes electrical connections through protruding contact elements, and serves as a substrate for subsequent conductor pattern formation. This multi-functionality reduces the need for separate fixtures or additional structural elements that would otherwise be required.
Solution Approach 2:
The intermediate product acts as a mediator between component embedding and conductor pattern formation. By providing a standardized intermediate with pre-positioned components and contact elements, it enables the use of existing manufacturing equipment for both stages without requiring direct integration of incompatible processes.
3Ease of manufacture
If a unified conductor membrane is used instead of pre-formed conductor patterns, then component attachment is simplified, but conductor pattern formation must be delayed to a later stage
Solution Approach 1:
Components are attached to the unified conductor membrane in advance, allowing the membrane to serve as both attachment substrate and future conductor pattern source. This preliminary action simplifies component handling and positioning, while the conductor patterns are subsequently formed by removing excess membrane material in a later etching or lithography step.
Data Source
AI summary
Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.