Embedded Component Package Groove Buffer Design
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Solution Overview
Problem
The existing substrate embedded electronic component packages face issues with damage to electronic components due to collisions with the substrate, such as cracking or breakage, during the embedding process.
Innovation Solution
The proposed solution involves a substrate embedded electronic component package design with a core member having a cavity and a metal layer on its bottom surface, an electronic component embedded within the cavity, and an encapsulant covering both the core member and the electronic component. The cavity's wall surface features a groove portion that protrudes outward, providing a free space around the electronic component's corner to mitigate damage from collisions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic component is embedded directly in the substrate cavity, then the device achieves miniaturization and high integration, but the electronic component is susceptible to damage from collisions with the substrate
Solution Approach 1:
The patent applies beforehand cushioning by forming a groove portion in the cavity wall before embedding the electronic component. This groove creates a buffer zone that absorbs collision forces during the embedding process, preventing direct impact damage to the component while maintaining the miniaturized device structure. The groove acts as a pre-prepared protective feature that cushions the component against substrate collisions.
2Reliability
If the cavity is made larger to accommodate protective features, then component damage is reduced, but the device size increases
Solution Approach 1:
The patent applies local quality by creating a groove portion only at specific locations on the cavity wall where protection is needed, rather than enlarging the entire cavity. This localized modification provides protective buffer zones exactly where collision forces occur during embedding, while maintaining the overall compact dimensions of the device. The groove adds protection without proportionally increasing device volume.
3Reliability
If the groove portion is added to the cavity wall, then component damage from collision is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the cavity wall into distinct regions: smooth portions and groove portions. This segmentation allows the groove to be formed as a separate, localized feature rather than a complex overall cavity shape. The groove portion can be created using standard manufacturing techniques like laser drilling or mechanical machining, adding protection without requiring fundamentally new manufacturing processes.
Data Source
AI summary
A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.