Embedded Component PCB With Cavity Mounting
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Solution Overview
Problem
Conventional printed circuit boards face limitations in providing a sufficient mounting area for multiple devices, hindering the development of truly multi-functional, smaller, and slimmer electronic products due to the small size of the package board.
Innovation Solution
A printed circuit board design featuring a multilayered substrate with a cavity and bump pads, where a first electronic component is inserted into the cavity and connected via conductive balls, and optionally a second component is mounted on the substrate, with an encapsulant sealing the gap to enhance electrical connectivity and support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple chips are mounted on multilayered substrates using conventional bump pad methods, then the mounting area is increased, but the package board size becomes too large for smaller and slimmer electronic products
Solution Approach 1:
The invention transitions from two-dimensional surface mounting to three-dimensional embedded mounting by creating cavities within the multilayered substrate. Electronic components are inserted into these cavities and sealed with encapsulants, utilizing the vertical dimension (substrate thickness) to provide mounting space. This allows multiple components to be embedded within the substrate volume rather than only on its surface, effectively increasing mounting area without increasing the package board's footprint.
2Volume of moving object
If the package board is reduced in size to meet smaller electronic product requirements, then the mounting area becomes insufficient for mounting multiple devices
Solution Approach 1:
The invention embeds electronic components within cavities formed inside the multilayered substrate, similar to nesting objects within containers. The components are positioned within the substrate's internal volume and sealed with encapsulants, effectively nesting the components within the package board structure. This nesting approach maximizes the use of available space within a compact package board, providing sufficient mounting area for multiple devices without increasing the overall package size.
3Adaptability or versatility
If conventional surface mounting methods are used, then the electronic products cannot achieve truly multi-functional capabilities due to limited mounting area
Solution Approach 1:
By creating cavities within the multilayered substrate and embedding components in three dimensions, the invention significantly increases the available mounting area within a compact footprint. This dimensional transition from surface-only mounting to volume-based mounting enables the integration of multiple diverse electronic components, allowing electronic products to achieve truly multi-functional capabilities with enhanced adaptability and versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a larger mounting area within a compact size, enabling the integration of multiple electronic components while maintaining a thin and lightweight structure, enhancing the functionality and performance of electronic products.
Implementation Method 1
A volume of the core may increase or decrease in response to a change in temperature
Implementation Method 2
an encapsulant filling in a space between the cavity and the first electronic component
Data Source
AI summary
A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.