Core-Embedded Passive Component Spacer for Alignment Stability
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Solution Overview
Problem
The integration of passive components like capacitors, inductors, and resistors into the package substrate core faces challenges due to thickness mismatches, leading to shifting and rotation during embedding, which complicates electrical contact and manufacturing.
Innovation Solution
The use of spacer layers and liners within cavities in the substrate core to support and secure passive components, ensuring proper alignment and thickness matching, thereby reducing displacement and facilitating easier electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are embedded in deep cavities through the core, then space utilization is improved, but the components may shift or rotate during embedding
Solution Approach 1:
The patent applies preliminary action by forming a support structure (spacer layer) at the bottom of the cavity before embedding the passive component. This pre-prepared support structure prevents shifting and rotation during the embedding process by providing immediate mechanical support and alignment references, thus resolving the contradiction between space utilization and manufacturing precision.
Solution Approach 2:
The patent introduces an intermediary element (spacer layer with alignment features) between the cavity bottom and the passive component. This intermediary structure mediates the interaction by providing a stable platform that prevents direct contact between the component and cavity walls, eliminating shifting and rotation while maintaining proper space utilization.
2Strength
If the substrate core thickness is defined by thermomechanical stress requirements, then structural integrity is maintained, but the thickness mismatch with passive components causes embedding problems
Solution Approach 1:
The patent segments the embedding structure into multiple functional layers: a support structure layer at the cavity bottom, an intermediate spacer layer with alignment features, and the passive component layer. This segmentation allows each layer to be optimized independently - the support structure maintains structural integrity while the spacer layer solves the thickness mismatch problem, making the embedding process easier.
Solution Approach 2:
The patent introduces an intermediary spacer layer between the core substrate and the passive component to bridge the thickness gap. This intermediary structure has a thickness that compensates for the mismatch between the thermomechanically-determined core thickness and the component thickness, thereby facilitating easier embedding while maintaining structural integrity.
3Manufacturing precision
If spacer layers are used to support components, then alignment and thickness matching are improved, but device complexity increases
Solution Approach 1:
The patent designs the spacer layer to perform multiple functions simultaneously: it provides mechanical support, establishes thickness matching, and incorporates alignment features for precise component positioning. By making the spacer layer multi-functional, the patent achieves improved alignment without proportionally increasing device complexity, as a single structure accomplishes what would otherwise require multiple separate elements.
Data Source
AI summary
Embodiments disclosed herein include components that are embedded within a core of a package substrate. In an embodiment, such an apparatus may comprise a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a cavity is provided through a thickness of the substrate, and a first layer is in the cavity. In an embodiment, the first layer has a first width. In an embodiment, a component is on the first layer, and the component has a second width that is smaller than the first width. In an embodiment, a second layer is provided between a sidewall of the cavity and a sidewall of the component.